Overview of the White paper, the Agenda and the Workstream.pdf

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1、OCP Global Summit October 18,2023|San Jose,CADr.Michael Bortz,Open Compute ProjectPhotonics for Computer Interconnects:FTI WorkshopFuture-looking Photonics InitiativeDeployment 3-5 years outShort-reach(0.1-10m),in-server interconnect applications of photonicsScale-up not scale-outDifferent use cases

2、Server Disaggregation/ComposabilityxPU-xPU&Cache Coherent InterconnectsxPU-Memory Interconnects/Disaggregation CXL/PCIE and NVMe/PCIE over PhotonicsFuture Technology Initiative WorkshopApplication and Technology TalksWhite Paper(Q4 2023)OCP FTI Workstream(Q1-Q3 2024)Like an informal OCP projectInter

3、ception points vs use caseFormal OCP ProjectLaunch at 2024 Global SummitPlenty of time for strategic alignmentWhy are we here?Workshop Technical ContentIntention/Plan to OCP ProjectExamples:Use Cases 1 With first-generation chips now available,the early hype around CXL is giving way to realistic per

4、formance expectations.At the same time,software support for memory tiering is advancing,building on prior work around NUMA and persistent memory.Finally,operators have deployed RDMA to enable storage disaggregation and high-performance workloads.Thanks to these advancements,main-memory disaggregatio

5、n is now within reach.Enfabrica sponsored the creation of this white paper,but the opinions and analysis are those of the author.Tiering Addresses the MemTiering Addresses the Memory Crunchory Crunch Memory tiering is undergoing major advancements with the recent AMD and Intel server-processor intro

6、ductions.Both AMDs new Epyc(codenamed Genoa)and Intels new Xeon Scalable(codenamed Sapphire Rapids)introduce Compute Express Link(CXL),marking the beginning of new memory-interconnect architectures.The first generation of CXL-enabled processors handle Revision 1.1 of the specification,however,wherea