Leading Interconnect Semiconductor Technology (Shenzhen) Co. Ltd.：Application Proof (1st submission).pdf

1、Hong Kong Exchanges and Clearing Limited,The Stock Exchange of Hong Kong Limited and the Securities andFutures Commission take no responsibility for the contents of this Application Proof,make no representation as toits accuracy or completeness and expressly disclaim any liability whatsoever for any

2、 loss howsoever arising from orin reliance upon the whole or any part of the contents of this Application Proof.Application Proof ofLeading Interconnect Semiconductor Technology(Shenzhen)Co.,Ltd.禮 鼎 半 導 體 科 技（深 圳）股 份 有 限 公 司(the Company)(A joint stock company incorporated in the Peoples Republic of

3、China with limited liability)WARNINGThe publication of this Application Proof is required by The Stock Exchange of Hong Kong Limited(theExchange)/the Securities and Futures Commission(the Commission)solely for the purpose of providinginformation to the public in Hong Kong.This Application Proof is i

4、n draft form.The information contained in it is incomplete and is subject to change whichcan be material.By viewing this document,you acknowledge,accept and agree with the Company,its sole sponsor,sole sponsor-overall coordinator,overall coordinators,advisers or members of the underwriting syndicate

5、 that:(i)This document is only for the purpose of providing information about the Company to the public in HongKong and not for any other purposes.No investment decision should be based on the information contained inthis document;(ii)The publication of this document or supplemental,revised or repla

6、cement pages on the Exchanges websitedoes not give rise to any obligation of the Company,its sole sponsor,sole sponsor-overall coordinator,overallcoordinators,advisers or members of the underwriting syndicate to proceed with an offering in Hong Kong orany other jurisdiction.There is no assurance tha