摘要：浸没式冷却技术中的高速互连信号完整性.pdf

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1、Terry Little(FIT)/Kai Wang(Intel)High-Speed Interconnect Signal Integrity in Immersion Cooling Technology(Whitepaper Abstract)Cooling Environments and Liquid CoolingHigh-Speed Interconnect Signal Integrity in Immersion Cooling Technology(Whitepaper)ContributorsTerry Little,Christine Tran,A.J.Yang(Fo

2、xconn Interconnect Technology)Kai Wang(Intel Corporation)Tina Bao(TE Connectivity)Beau Van Vaerenbergh(Oleon)Rolf Brink(Promersion)Todd Steigerwald(AMD)Austin Hipes(UNICOM Engineering)Cheney Chang,Justin Chiang,Peter Liu(Formericaoe)WaiKiong Poon(Molex)Cooling Environments and Liquid Cooling1.The Ne

3、ed for Immersion CoolingThe thermal demands of modern IT equipment have outpaced the capabilities of traditional air cooling.Accelerated by AI,HPC and other high-density workloads,processors are now exceeding 6001000 W per device,with full racks projected to reach hundreds of kilowatts to over 1 MW

4、in the coming years.These levels of power density cannot be sustained with airflow-based methods without creating prohibitive inefficiencies in footprint,power usage effectiveness(PUE)and cost.Looking ahead to 2030,the IT Equipment(ITE)landscape will be far more diverse and specialized than today.Ge

5、neral-purpose servers will decline,while AI/GPU-optimized,heterogeneous compute and edge platforms will dominate.Projections show that by 2030,approximately 30%of all new ITE will rely on immersion cooling in some form,often in hybrid systems that also integrate cold plates.Cold plates themselves ar

6、e expected to account for 45%of new IT systems,but many of these deployments will be paired with immersion to manage total system heat loads effectively.Cooling Environments and Liquid CoolingSource:Rolf Brink,Promersion,OCP 2025 Global Summit Presentation.Cooling Environments and Liquid Cooling2.Wh