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1、Nikhil KumarSenior Director of Photonics,LightmatterHigh Bandwidth XSR Driven Optical Links for CPOOCP SPECIAL FOCUS:PHOTONICS100X More bandwidth than existing chip-to-chip interconnect solutions.Solving the Biggest Bottleneck in AI Data CentersNETWORK AND MEMORY BANDWIDTHGholami A,Yao Z,Kim S,Mahon
2、ey MW,Keutzer K.AI and Memory Wall.RiseLab Medium Blog Post,University of California Berkeley,2021,March 29.Why bring optics closer to the SoC?-Reduction in interconnect power-Increased bandwidth-Higher bandwidth density at die edge-Bypass intermediate stages(PCIe)Enabling new communications technol
3、ogiesCloser and closer to the chipGen IPluggable OpticsGen IIOn-board OpticsGen III2.5D Co-packaged OpticsGen IV3D Stacked PASSAGEOptical LinksElectrical LinksPluggable Optical TransceiverOn-board Optics ModuleDisaggregated Laser SupplyCo-packaged PIC*Used with permission from Dr.John Bowers and ada
4、pted from an article in Applied Physics Letters(2021)*Passage L-SeriesPassage M-Series3D CPOAvailable 2026Photonic InterposerAvailable Now3D Photonics3D Stacked Photonic Interposer:Shoreline Bandwidth Density(4x higher Tbps/mm)Minimal Package Size IncreaseInterconnect Reach 250m+In-silicon Optical C
5、ircuit Switching(OCS)Available in Two Packaging Options:L-Series:I/O Chip on PassageM-Series:Chip Complex on PassageL-Series(I/O Chip on Passage)M-Series(Chip Complex on Passage)-16-800 GBPS/FIBER-BER 1e-10-Off-shelf XSR SerDes-800G on one fiber-Standard SM fiber-Polarization insensitive-1 km fiber
6、spool-6 ConnectorsPERFORMANCE STABILITYInherent polarization insensitivityLIGHTMATTER LINK PLATFORM-16 Bidirectional-25 10525C-FEC-less BER=1e-10-Off-shelf XSR SerDes-800G on one fiber-Standard SM fiber-Polarization insensitive-1 km fiber spool-6 ConnectorsPOWERED BY GUIDEA single integrated laser P