支持更高功率机架冷却的方法.pdf

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1、Umut Uras NVIDIABahareh Eslami-NVIDIAMark Steinke-NVIDIAMethods to Support Higher Power Rack CoolingMethods to Support Higher Power Rack CoolingUmut Uras-NVIDIABahareh Eslami-NVIDIAMark Steinke-NVIDIACOOLING ENVIRONMENTS&LIQUID COOLINGIncreasing rack power density requires careful consideration on h

2、ow to supply cooling Traditional methods of liquid cooling racks may not be sufficientCoolant distribution form factors may need to evolve to meet cooling requirementsRack&CDU architecture should allow for flexible designs to support varied customer preferences Introduce“Rack Adjacent”CDUsSummaryTra

3、ditional Types of CDUsLiquid-Air(L2A)In-RowLiquid-Liquid(L2L)In-RackLiquid-Liquid(L2L)In-RowCoolant Distribution Units(CDU)Liquid-Air(L2A)In-RowLiquid-Liquid(L2L)In-RackLiquid-Liquid(L2L)In-RowTypical CapacitiesL2A In-Row 130 kWL2L In-Rack 200 kWL2L In-Row 1,600 kWTypical Facility Layout L2A“Sidecar

4、”CRAH or CRACPlate frame HXCDUTechnology Cooling System(TCS)contained in L2A Sidecars17 45CWhite Space/Data HallGray Space/Mechanical RoomCoolingTowersCondenser Water System(CWS)Facilities Water System(FWS)Raised Access FloorCondenser Water System(CWS)Typical Facility Layout L2L In-Rack CDUPlate fra

5、me HXCDUFacilities Water System(FWS)Technology Cooling System(TCS)contained in-rack17 45CWhite Space/Data HallRaised Access FloorGray Space/Mechanical RoomCoolingTowersTypical Facility Layout L2L In-Row CDUPlate frame HXCDUCDUCondenser Water System(CWS)Facilities Water System(FWS)Technology Cooling

6、System(TCS)17 45CWhite Space/Data HallRaised Access FloorGray Space/Mechanical RoomCoolingTowersCDURack space trade-offsCompute vs.Power vs.CoolingPower vs.Energy Storage vs.Fluid ManagementCooling domain trade-offsCompute Cost Fluid Domain SizeCDU size&featur