Edge-MHS——完整规范的基础已经到来——了解细节.pdf

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1、Dirk Blevins Intel CorporationDavid Heinrich HPEGreg Sellman AMDXinxin Wang H3CRob Nance JabilEdge-MHS Understanding the DetailsEdge-MHS Understanding the DetailsDirk Blevins Intel CorporationDavid Heinrich HPEGreg Sellman AMDXinxin Wang H3CRob Nance JabilEdgeEdge-MHSModular hardware system designed

2、 for the EdgeCompatible with DC-MHS where applicableAllows system providers to adopt scale more rapidlyRe-usable in multiple design environmentsA couple of potential board types-3 distinct problems based on chassis depth:Short,Mid,ExtendedAI Optimized for Edge AI Sleds or AI Add-In Cards19”1RU or 2R

3、U rack optimizedPre-solves technical challenges expected to be faced in Edge solutionsTiming Module&GNSS Module Support(refer to OCP NIC)DC-SCM Compact Form Factor(CFF)Support(1U Class L)310 mm Deep(Two 1U Class N Left,2U Class N Right)430mm Deep430 mm350 mm310 mmChassisDepth60 mm 60 mmClass LLarge

4、Type 295mm Wide x 250-365mm LongScalableClass N Narrow Type 168mm wide x250 365mm longScalableDC-SCM CFFEdge-MHS 1.0 Compatibility GoalsDifferent E-MHS Boards in same chassisSame E-MHS Boards in different chassisKey Elements of Edge-MHSClass N 365mmClass L 365mmHPM Class N&L OutlinesHPM Compatibilit

5、y Overlays3 boards shown to the right(Class N365,Class L260,Class N350)Common chassis support enabled to support the following configurations:1 Class N(illustrated by N365 placement)1 Class L(illustrated by L260 placement)2 Class N(illustrated by the N365 and N350 placement)Allows system providers t

6、o adopt different solutions more easilyAllows chassis providers to develop common chassis supportAllows common mounting holes and common riser assemblies across multiple configurationsWhen implementing 181-millimeter pitch between N365 and N350 to allow mounting points to work when trying to utilize