CDX 和 3DK：实现开放、可扩展的芯片集成.pdf

1、Chiplet Design Exchange and 3DK:Enabling Open,Scalable Chiplet IntegrationOrganizationChiplet Design Exchange and 3DK:Enabling Open,Scalable Chiplet IntegrationDavid RatchkovCTO,Palo Alto ElectronCo-lead,Chiplet Design ExchangeSERVERChiplet Design Exchange is a workstream under Open Chiplet EconomyO

2、ur charter is to develop chiplet standards and facilitate workflow interoperability of EDA tools and design exchange for chiplet developmentIntroduction to CDXStandardsWorkflows3DK Schema described with OCP CDXML/JEDEC JEP30Develop and describe chiplet integration workflowsPublished:CDK,ADK,MDK,TDKW

3、ork in progress:SI/PI DK,PDRM,TDK 2.0Published white paper“Guide to Integration Workflows for Heterogeneous Chiplet Systems”CDX Demo Design3DK:3D-IC Design Kit3DKADKMDKTDKSI/PI DKCDKPDRMAssembly Design KitDescribe package assembly rules Material Design KitDescribe material propertiesTest Design KitD

4、escribe test pins Package Design Rule Manual KitsDescribe package stack up and design rulesChiplet Design KitChiplet description,including physical,electrical,etc.SI/PI Design KitTarget design and sign-off verification using targets defined in CDXML by IP and chiplet vendors3DK Application in Workfl

5、owsArchitectureChiplet selectionCDK for choosing chipletsADK for chiplet compatibilityDRM for package technologyPackage planingDRM for choosing a technologyMDK for material propertiesSystem planningADK for physical floorplanCDK for netlist creationPerformance analysisSI/PI Design KitMDK for thermalD

6、esignDFTTDK for test connectivityPackage designDRM for design rulesSign-offSI/PI analysisSI/PI Design Kit for sign-off targetsMDK for material propertiesThermal and mechanical analysisMDK for material propertiesDemonstration vehicle for CDXML/JEP30 and integra