欧特克 Moldflow 2026 峰会（Autodesk Moldflow Summit 2026）嘉宾演讲PPT合集（共14套打包）

1、ADVANCES IN LIGHTWEIGHTING VALIDATION TopicsMaterial characterization of TPO&CFAsCAD simulation capabilitiesCorrelating CAD simulations to molded partsSupporting sustainable automotive designsCop。

2、JOYSONQUIN Automotive Systems GmbH /08/05/2026/1Closing the Sim-to-Reality Gap:Thermo-Mechanical Validation of“In-Wood Decoration”Insert MoldingJuan Ruiz Tooling Engineer|CAE-Moldflow Specialist JOYS。

3、Dr.Franco Costa,Moldflow Solver and Meshing Team LeaderMoldflow R&D UpdateApril 2026AgendaMoldflow 2026 Update 1Moldflow 2027AI Coding with Solver APICurrent DevelopmentsMoldflow 2026 Update 1For。

4、“Moldflow Does Not Match Reality!”Do You Know Why?J.Michael GarrettFilling Analysis Mismatch?At Synventive,we do a lot of processing.We set up process conditions both within Moldflow and standing at 。

5、Integrating Moldflow Insights into Digimat for Injection Gate Position AnalysisDustin Souza,Business Development MFlow to Fiber Orientations:Smarter Gate Placement 2026 Cadence Design Systems,Inc.All。

6、Evaluation of Effects of Wax Additive on Injection MoldingBrian Young,Merek JaworskiSchool of Engineering,Penn State Behrend,Erie,Pennsylvania 16563,United StatesPenn State Plastic Team Penn State Be。

7、AI Agent Platformfor EngineeringWeeks turn into minutes when Synera joins the teamThe business dilemma.Cost PressureLegacy,fragmented tools slow down progressManual orchestration and long time-to-mar。

8、 2026 Autodesk.All rights reserved.April 2026Tips and helpful resources for MoldflowJuan Zamora,PrincipalTechnical Support SpecialistImage courtesy of NameTO REPLACE IMAGE:1.Right-click image2.Select。

9、Innovative Simulation Method for Ink Washout Prediction in Film Insert MoldingMoldflow Summit 2026Dr.-Ing.Sarah FrauholzApril 2026CovestroInnovativeand sustainable1,300 employeesin research and devel。

10、Safe Harbor Statementwww.sec.govThe presentations during this event may contain forward-looking statements about our outlook,future results and related assumptions,total addressable markets,acquisiti。

11、Hanno van Raalte,Product Manager for MoldflowMoldflow 2027Whats newAgendaMoldflow 2027Moldflow Scandium 2027 UpdateFinal ThoughtsMoldflow 2027Moldflow 2027|Release overviewProductivity&WorkflowNe。

12、Jon den HartogVice PresidentProduct Development and Manufacturing Solutions Product Development&Manufacturing withArtificial Intelligence 2026 Autodesk.All rights reserved.April 2026Safe harbor s。

13、Can STAMP Move Us Closer to a Digital Twin?Hunter BeaumontThe Madison GroupDigital TwinThe Madison Group 608-231-1907Hunter BThe Madison GroupOffices in Madison,Milwaukee and Pittsburgh.Engineering c。