2948 - 高性能处理器路线图：Power11、内存架构、企业级人工智能和芯片组.pdf

1、Orlando,FLOctober 69IBM TechXchange 20252948Power Processor Roadmap:Power11,Memory Architecture,Enterprise AI,and ChipletsWilliam StarkeIBM Distinguished EngineerPower Processor Chief ArchitectIBM Power Processor RoadmapContinuous Platform Innovation and LeadershipPOWER8POWER9Power10Power11Power Fut

2、urePowerful SMT8 CoreEnterprise ScalingBig Data OptimizedAgnostic MemoryModular Core DesignAccelerator Attach (NVlink,OpenCAPI)Data Plane BandwidthDDR&CDIMM MemoryCore/Thread StrengthSocket PerformanceIn-Core AI AccelerationEfficiency/SustainabilityHW Accelerated SecurityCore/Thread StrengthSocket P

3、erformanceEnterprise ScalingEnergy OptimizationImproved up-timeFull Breadth AI(Under development)Information is forward looking and plans are subject to change based upon IBMs discretionInformation is forward looking and plans are subject to change based upon IBMs discretionPower11:Full Stack Innova

4、tion and Cross-OptimizationProcessor ArchitectureSocket-level PackagingSemiconductor TechnologyImproved Thread,Core,CapacityISC Silicon Layer:Energy OptimizationSamsung Foundries Enhanced 7nmPower10Processor/SystemFoundationInformation is forward looking and plans are subject to change based upon IB

5、Ms discretionProcessor Silicon Optimization:Improved Performance&Energy Mgmt,Socket TDP InnovationSocket Packaging Innovation:2.5D silicon stacking Optimized Energy DeliverySystem Thermal Innovation:Improved Cooling Enabling Higher ThroughputProcessor SiliconImprovements2.5D Silicon PackagingInnovat

6、ion System ThermalInnovation Multiple Factors Improve PerformanceInformation is forward looking and plans are subject to change based upon IBMs discretionPower11:Full Stack Innovation and Cross-OptimizationProcessor ArchitectureSocket-level PackagingSemiconductor TechnologyImproved Thread,Core,Capac