2017年汽车照明所需之关键封装技术.pdf

1、1LED Packaging Technologies for Automotive LightingS.W.Ricky LeeCenter for Advanced Microsystems PackagingHKUST LED-FPD Technology R&D Center at FoshanHong Kong University of Science and TechnologyClear Water Bay,Kowloon,Hong KongAlighting Forum 2017 22ndGuangzhou International Lighting ExhibitionGu

2、angzhou,Guangdong,China2017 6 102Possible Applications of LEDs3LEDs for Traffic Applications4HKUST LED Saloon Lighting Project for Subway5Current Applications of LEDs on CarsLEDs can be found almost everywhere on a car6Possible Locations for Installing LEDs on a CarSource:OSRAM7LEDChallenges of LEDs

3、 for Headlamp ApplicationsHeadlamp Headlamp works in a high temperature environment(LED thermal management).Perceived spectrum drift and luminance drop of LEDs with age(LED reliability).Stringent beam shaping requirements for the headlamp(Advanced optics design).8Conventional LED Package StructureSM

4、D-LED packagePhosphorsLeadframeLED dieGold wireAdhesiveA conventional SMD white-light LED package9LED waferDicingDie mountingWire bondingEncapsulantdispensingPhosphor mixing(optional)Testing and singulationCuringPhosphor coating(optional)Molding(dip or compression)Lens mounting+encapsulation(optiona

5、l)Typical Processes of Chip-based LED Packaging10Typical Commercial LED PackagesLamp LED(x)Elliptical/Bullet HeadSnap LED35285050Luxeon K2Emitter K1Top/SMD LEDGolden DragonCreeXLampLumiledsRebelNichiaNVS/NCSxCOB LED11Conventional LED Packaging vs.WLPWLPSingulationLED componentsWafer Level Packaging(

6、WLP):To package the whole wafer instead of individual chips Merits of WLP:Good uniformity and high throughput(has been demonstrated in IC and MEMS packaging industry already)12Considerations in LED WLPSemi Wafer Level Packaging-Dice the device wafer first and then mount the diced chips on a carrier