Rambus:2025 DRAM技术规模化演进以应对未来需求研究报告:挑战与机遇(英文版)(135页).pdf

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Rambus:2025 DRAM技术规模化演进以应对未来需求研究报告:挑战与机遇(英文版)(135页).pdf

1、Scaling DRAM Technology to Meet Future Demands:Challenges and OpportunitiesISCA 2025 TutorialWaseda University,Tokyo,JapanJune 22,2025Steven Woo,Rambus Inc.Wendy Elsasser,Rambus Inc.Taeksang Song,Samsung Electronics 2ISCA 25 Tutorial:Scaling DRAM Technology to Meet Future Demands Challenges&Opportun

2、itiesISCA 25 Tutorial:Scaling DRAM Technology to Meet Future Demands Challenges&OpportunitiesWendy Elsasser is a Technical Director of Research Science at Rambus.She works in the Rambus Labs R&Ddivision investigating future system architectures and developing innovative solutions to address the impa

3、ct onthe memory sub-systems.She has over 25 years of experience in industry,starting with semi-custom micro-controller design,test,and implementation.Over the last 20 years,her focus has been on memory sub-systems,primarily external DRAM.Her experience includes DRAM controller architecture,design,an

4、d validation as well asactive contributions to consortiums and standards bodies.Specifically,she was a leader in the Gen-Z consortiumand JEDEC,helping to define future memory interfaces and DRAM standards.Her work has resulted in 15 patents.Todays PresentersTaeksang Song is a Corporate Vice Presiden

5、t at Samsung Electronics where he is leading a team dedicated topioneering cutting-edge technologies including CAMM,MRDIMM,CXL memory expanders,fabric attachedmemory solutions and processing near memory to meet the evolving demands of next-generation data-centric AIarchitectures.He has 20 years prof

6、essional experience in memory and sub-system architecture,interconnectprotocols,system-on-chip design and collaborating with CSPs to enable heterogeneous computing infrastructure.Prior to joining Samsung Electronics,he worked at Rambus Inc.,Micron Technology and SK hynix in lead architectroles for t

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