美银BofA:美国半导体行业研究:AI韧性、模拟芯片温和、半导体设备承压、消费电子疲软-250901(英文版)(14页).pdf

编号:913402 PDF  中文版  DOCX 14页 570.69KB 下载积分:至尊VIP专享
下载报告请您先登录!

美银BofA:美国半导体行业研究:AI韧性、模拟芯片温和、半导体设备承压、消费电子疲软-250901(英文版)(14页).pdf

1、 BofA Securities does and seeks to do business with issuers covered in its research reports.As a result,investors should be aware that the firm may have a conflict of interest that could affect the objectivity of this report.Investors should consider this report as only a single factor in making the

2、ir investment decision.Refer to important disclosures on page 11 to 14.Analyst Certification on page 10.Price Objective Basis/Risk on page 5.12871935 US Semiconductors State of the union:Resilient AI,Lukewarm Analog,Tricky Semicap,Tough consumer Industry Overview SOX roadmap:weak September,followed

3、by strong Q4/Q1 We remain selectively positive on chip stocks entering what has historically been their weakest month(Sep:SOX down-5%/-2%on avg past 5/10 yrs.),as its usually followed by the strongest 2 quarters(Q4 up+15%/+10%,Q1 up+5%/+7%,on avg last 5/10 years).While YTD the SOX has outperformed t

4、he broader SPX,+14%vs.+10%,semis have lagged thus far in Q3 following muted outlook and/or post-print reactions by notable companies(MRVL,AMAT,TXN,ASML,NVDA,AMD).SOX is currently trading at a 23.5x forward PE,just about 1x turn above the SPX,lower than the 3x+PE turn historical premium since late CY

5、22 when the ChatGPT and AI capex cycle started.Maintain ratings on covered companies.Top debates/themes/picks ahead of Q4 seasonal recovery We are watchful during Sep headwinds but expect seasonal momentum to return in Q4.The cyclical framework still broadly favors semis on a combination of secular(

6、AI capex)and cyclical(industrial inventory replenishment,easier YoY compares in autos).But,market volatility could(re)energize investor debates.:1)CY26 AI capex growth;2)Impact of any new US semicap equipment restrictions on China,related the outlook for leading edge-fab equipment demand at TSMC and

友情提示

1、下载报告失败解决办法
2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
4、本站报告下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。

本文(美银BofA:美国半导体行业研究:AI韧性、模拟芯片温和、半导体设备承压、消费电子疲软-250901(英文版)(14页).pdf)为本站 (111111) 主动上传,三个皮匠报告文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知三个皮匠报告文库(点击联系客服),我们立即给予删除!

温馨提示:如果因为网速或其他原因下载失败请重新下载,重复下载不扣分。
客服
商务合作
小程序
服务号
折叠