增材和3D电子学的关键技术创新(TechBlick).pdf

编号:908403 PDF 46页 3.70MB 下载积分:VIP专享
下载报告请您先登录!

增材和3D电子学的关键技术创新(TechBlick).pdf

1、CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOME1Process Innovations in Additive and 3D Electronics From Analoge to DigitalAddressing issues like speed,resolution,digital,material choice,etcPrinted Electronics is Everywhere-From diapers to precision missiles!CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMEAgenda:

2、Process“InnovationsFrom screen to dry inkjet less laser printing#Screen#Capillary#Dispensing#Inkjet#EHD#Microdispensing#LIFT#LaserPrint#DryMultiMaterial and BeyondNo Time For Material or Application Innovations 2CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMECONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMEwww.Te

3、chB linewidth improvement in screen printed photovoltaic metallisation.5CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMEReearch progress in ultrafine screen printed fingersSources:.Tepner&A.Lorenz,Printing technologies.”,Progress in Photovoltaics,2023CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMEAnd the industr

4、y has followed.7Sources:.TechBlick compilation from ITRPV roadmap dataCONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMETeam work:Paste and screen evolution Paste optimization(rheology,particle size,wall slip)Ultra fine stainless steel meshes(today:520-11 mesh)Laser opening of screens(channel width 20 m)Sour

5、ces:Fraunhofer ISECONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMENot just linewidth but also production speed.9CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMESource:Suzhou Maxwell Technologies Co.,Ltd.Half-cell TOPCon printing as exampleFull wafer turnkey solution in industry now 8470 PCS Wafer/Hour M10Incredib

6、le print speeds and parallelisation CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMEAutomatic full solar wafer screen printing11CONNECT|ENGAGE|LEARNwww.TechBHOMEHOMEHOMECan we do rotary screen printing.?Rotary screen printing(single lane)up to 8000 Wafer/h(cycle time of 0.45 s)SHJ PVs50um linewidth or so12

友情提示

1、下载报告失败解决办法
2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
4、本站报告下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。

本文(增材和3D电子学的关键技术创新(TechBlick).pdf)为本站 (卢旭先生) 主动上传,三个皮匠报告文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知三个皮匠报告文库(点击联系客服),我们立即给予删除!

温馨提示:如果因为网速或其他原因下载失败请重新下载,重复下载不扣分。
客服
商务合作
小程序
服务号
折叠