6659 - Lessons Learned and Scaling OpenRAN vDUs for the Future.pdf

1、Kevin DeveyLessons Learned and Scaling OpenRAN vDUs for the FutureSPECIAL FOCUS:OPENRANLessons Learned and Scaling OpenRAN vDUs for the FutureKevin DeveySPECIAL FOCUS:OPENRANCurrent State of OpenRAN vDU Vendor ChallengesOpportunity ConsolidationOEM BOEM COEM DOEM EOEM ARFP#1RFP#2RFP#3RFP#4OEM AOEM B

2、All diagrams illustrative only.Investment ProfilesOEMsEnterpriseTelcoOtherAIPreviousAICurrentOperator Capex2224 25212320Limited Design Re-Use1U RackMount,500mm2U Full Width300mm DeepPCBBD-SFFRiser 2PSU 2BMCPCBAPCIe AICRiser 1PSU 1BMC2U Sled,500mm DeepPCBCPCIe AICPSU 1Riser 4BMCRiser 3TimingTimingTim

3、ingvDU SolutionHardware/Software AbstractionOEM Firmware ACaaS Release 1.0SiliconvDU Release 1.0vDU SolutionDesired StateValidation Impact:CaaSValidation Time:DaysOEM Firmware ACaaS Release 1.1SiliconvDU Release 1.0Current StateValidation Impact:SolutionValidation Time:MonthsUpdateCurrent State of O

4、penRAN vDU Operator ChallengesRFP Management Traditional RANTEM ProductOperator Learning CurveOpenRANOEM ProductCaaS ProductSi ProductISV ProductO-RU ProductRFP ContentsManagementSoftwareHardwareOrchestrationRadioOEM#1CaaS#1Silicon#1vDU#1Radio#1SI#1RFx ComplexityOEM#2CaaS#2Silicon#2vDU#2Radio#2SI#2O

5、EM#3CaaS#3Radio#3InternalRFP ChallengesTelcoComputeRFx Process TimeOEMsTEM OfferingsProduct A:Traditional RANProduct B:OpenRANTransition DifficultiesNSA to SASpec Readiness4G4G+5G4G5G3GPP ReadyO-RAN ReadyAll diagrams illustrative only.Scaling OpenRAN vDU for the FutureFocus on Open Standards and Par

6、tnershipsMove faster through deeper cooperation4G4G+5G4G5G4G6G5G3GPPO-RANSilicon VendorOCP(Edge-MHS,O-RU)AI ExplosionHardware VendorCaaS VendorvDU/vCU VendorStandardize TogetherPartner to AccelerateEmbrace Open Standards&ResiliencyCombine MHS ingredients as needed to address requ