華虹半導體：2024年年度報告.pdf

1、HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:01347)（股份代號：01347）（於香港註冊成立之有限公司）CONTENTSDefinitions2Key Financials6Letter to Shareholders7Corporate Information9Directors and Senior Management Team12Corporate Governance Report22Directors Report3420

2、24 Environmental,Social and Governance Report66Independent Auditors Report293Consolidated Statement of Profit or Loss302Consolidated Statement of Comprehensive Income303Consolidated Statement of Financial Position304Consolidated Statement of Changes in Equity306Consolidated Statement of Cash Flows30

3、8Notes to Financial Statements310Five Year Financial Summary4122HUA HONG SEMICONDUCTOR LIMITED 2024 ANNUAL REPORTDEFINITIONSIn this annual report,unless otherwise required by the context,the following terms shall have the meanings set out below.“Annual General Meeting”or “AGM”an annual general meeti

4、ng of the Company to be held on 8 May 2025;“Articles”the articles of association of the Company(as amended from time to time);“Board”the Board of Directors of the Company;“China IC Fund”China Integrated Circuit Industry Investment Fund Co.,Ltd.*(國家集成電路產業投資基金股份有限公司),a company incorporated in the PRC

5、on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain financial institutions and private enterprises.It mainly focuses on the manufacturing of semiconductor wafers and takes into ac

6、count the upstream and downstream links covering chip design,package test,equipment and materials etc;“China IC Fund II”China Integrated Circuit Industry Investment Fund(Phase II)Co.,Ltd.*(國家集成電路產業投資基金二期股份有限公司),a company established in the PRC on 22 October 2019;its shareholders include the Ministry