Session 10Transceiver Chipsets for Communications and Radar.pdf

1、Session 10 Overview:Transceiver Chipsets for Communications and Radar WIRELESS SUBCOMMITTEEIntegrated circuits continue to advance the performance of wireless applications from a few megahertz to hundreds of gighertz.Wireless communication,radar chipsets&ultra-low-power transceivers are ubiquitous i

2、n our industry.This session presents several key innovations in such domains.Session Chair:Matteo Bassi Infineon Technologies,Villach,AustriaSession Co-Chair:Shahriar Shahramian Nokia Bell Labs,New Providence,NJ200 2025 IEEE International Solid-State Circuits ConferenceISSCC 2025/SESSION 10/TRANSCEI

3、VER CHIPSETS FOR COMMUNICATIONS AND RADAR/OVERVIEW979-8-3315-4101-9/25/$31.00 2025 IEEE9:15 AM 10.4 A 2-TRX IR-UWB Transceiver wit h Shared Ant ennas Support ing Channels 5 t o 12 in Compliance wit h IEEE 802.15.4/4z St andards Hyun-Gi Seok,Samsung Electronics,Hwaseong,Korea In Paper 10.4 Samsung El

4、ectronics presents a dual transceiver IR-UWB chipset with shared antennas that is compliant with IEEE 802.15.4/4.The IC supports channels 5 to 12 with a peak power of 14dBm and a Noise Figure of 4.2dB with a transformer-based LC resonator at the TX/RX shared ports.9:30 AM 10.5 A 28nm Mult imode Mult

5、 iband RF Transceiver wit h Harmonic-Reject ion TX and Spur-Avoidance RX Support ing LTE Cat 1bis Fei Song,XINYI Information Technology,Shanghai,China In Paper 10.5,XINYI Information Technology and XINYI Semi present a low-cost(QFN)28nm RF transceiver supporting LTE Cat1bis for IoT applications.The

6、low-power IC consumes 40mW in receive mode and 113mW in TX mode covering 0.6 to 2.7GHz.The receiver achieves an FDD/TDD sensitivity of better than-99dBm.8:50 AM 10.3 A D-Band 2D-Scalable 44 Act ive Reflect ive Relay wit h Ort hogonally Polarized On-Chip TX/RX Ant ennas and In-Front-End Common-Cent r