Session 2Processors.pdf

1、Session Chair:Jie Gu Northwestern University,Evanston,IL Session 2 Overview:Processors DIGITAL ARCHITECTURES AND SYSTEMS SUBCOMMITTEEProcessors are the driving workhorses of modern high-perf ormance computing.This session presents the next-generation processors f or both general-purpose computing an

2、d specialized computing.The first three papers deliver the next-generation CPU processors and networking processors,f ollowed by a 20-chiplet heterogenous 2.5D system in the f ourth paper.The remaining papers present the state-of-the-art super-resolution image and video processors,as well as advance

3、d 3D rendering processors.Session Co-Chair:Nathaniel Pinckney Nvidia,Austin,TX 42 2025 IEEE International Solid-State Circuits Conf erenceISSCC 2025/SESSION 2/PROCESSORS/OVERVIEW979-8-3315-4101-9/25/$31.00 2025 IEEE1:30 PM 2.1 “Zen 5”:The AMD High-Performance 4nm x86-64 Microprocessor Core Spence Ol

4、iver,AMD,Austin,TX In Paper 2.1,AMD presents Zen 5,their next-generation x86-64 microprocessor core,targeting both desktop and laptop applications.Built in TSMC s 4nm FinFET process,the 55mm2 core complex integrates 8.6B transistors across 8 CPU cores.Each core delivers a generational 16%IPC improve

5、ment over Zen4,while maintaining a maximum f requency of 5.7GHz.1:55 PM 2.2 IBM Telum II:Next Generat ion 5.5GHz Microprocessor wit h On-Die Dat a Processing Unit and Improved AI Accelerat or Gerald Strevig,IBM Systems,Austin,TX In Paper 2.2,IBM showcases their next-generation 5.5GHz Telum II microp

6、rocessor with an enhanced AI accelerator and a new Data Processing Unit f or I/O of fload.The 600mm2 die with 43B transistors in 5nm benefits f rom+40%L2 cache,on-chip voltage control,+36%X-BUS bandwidth,and reliability enhancements,while staying within 5%power of the prior generation.2:20 PM 2.3 Gr