Session 6Imagers and Displays.pdf

1、Session 6 Overview:Imagers and Displays I MAGERS,MEDI CAL,AND DI SPLAYS SUBCOMMI TTEEImage sensor technology continues to evolve in two main directions:(1)high-resolution,high-dynamic-range,high-speed imaging using 3D integrated technology,and(2)low-power,background-resilient depth sensing using SPA

2、Ds.The first paper introduces a high-resolution imager with hybrid shutter operation.This is followed by two SPAD-based time-of-flight sensors,excelling in low power consumption,and immunity to strong background light,respectively.Finally,three imagers with pixel-parallel ADC architectures are prese

3、nted,offering high-quality global-shutter solutions for consumer cameras,AR/VR systems,and LW-IR imaging.Display technology continues to advance in two main directions:(1)source-driver ICs with uniform,high color depth,area-and power-efficient design,and(2)touch analog front-end ICs with high SNR an

4、d frame rate.The first three papers introduce different source-driver ICs:the first is designed for OLED-on-Silicon(OLEDOS)displays with uniform outputs,the second features an OLED driver IC with a real-time pixel compensator,and the third focuses on a compact OLED driver IC utilizing a delta-sigma

5、modulation technique.The final paper presents an EMI-reduced touch analog front-end IC for CISPR 25 class 5 for automotive displays.Session Chair:Leonardo Gasparini FBK,Trento,Italy Session Co-Chair:Hyung-Min Lee Korea University,Seoul,Korea 112 2025 IEEE International Solid-State Circuits Conferenc

6、eI SSCC 2025/SESSI ON 6/I MAGERS AND DI SPLAYS/OVERVI EW979-8-3315-4101-9/25/$31.00 2025 IEEE1:30 PM 6.1 A 3-St acked Hybrid-Shut t er CMOS I mage Sensor wit h Swit chable 1.2m-Pit ch 50Mpixel Rolling Shut t er and 2.4m-Pit ch 12.5Mpixel Global Shut t er Modes for Mobile Applicat ions Heesung Shim,S