華虹半導體：2024年中期報告.pdf

1、2024中期報告INTERIM REPORT HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:01347)（股份代號：01347）（於香港註冊成立之有限公司）DEFINITIONS1INTERIM REPORT 2024In this interim report,unless the context otherwise requires,the following terms shall have the meanings set out

2、below.“Board”the board of Directors of the Company;“China”or“the PRC”the Peoples Republic of China,but for the purpose of this interim report and for geographical reference only,except where the context otherwise requires,references in this interim report to“China”and the“PRC”do not include Taiwan,t

3、he Macau Special Administrative Region and Hong Kong;“Company”or“our Company”Hua Hong Semiconductor Limited,a company incorporated in Hong Kong with limited liability on 21 January 2005 and,except where the context otherwise requires,all of its subsidiaries,or its present subsidiaries where the cont

4、ext refers to the time before it became the holding company of its present subsidiaries;“Company Secretary”the company secretary of the Company;“Director(s)”the director(s)of the Company;“EPS”earnings per share;“Executive Director(s)”the executive Director(s)of our Company;“Group”our Company and our

5、 subsidiaries or,where the context so requires,the businesses operated by our subsidiaries or their predecessors(as the case may be)with respect to the period before our Company became the holding company of our present subsidiaries(or became associated companies of our Company);“HHGrace”Shanghai Hu

6、ahong Grace Semiconductor Manufacturing Corporation*(上海華虹宏力半導體製造有限公司),a company incorporated in the PRC on 24 January 2013 and a wholly-owned subsidiary of the Company;“Hua Hong Manufacturing”Hua Hong Semiconductor Manufacturing(Wuxi)Co.,Ltd.*(華虹半導體製造(無錫)有限公司),a company incorporated in the PRC on 17