支持下一代纵向扩展架构具有光学连接的人工智能计算ASIC.pdf

1、1Broadcom Proprietary and Confidential.Copyright 2023 Broadcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its subsidiaries.|Broadcom Proprietary and Confidential.Copyright 2023 Broadcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its subsidiaries.An A

2、I Compute ASIC with Optical Attach to Enable Next Generation Scale-Up ArchitecturesAugust 26th,2024Manish MehtaVP Marketing and Operations Optical Systems Division2Broadcom Proprietary and Confidential.Copyright 2023 Broadcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its su

3、bsidiaries.|Our objective Build an optical interconnect that provides substantial improvements over current optical modules on cost,power consumption reliability and latency Build a high-density optical interconnect that enables up to 1 Tb/s/mm duplex connectivity to support current gen and next gen

4、 scale-up and scale-out optical BW densityOur Progress Shipped first generation proof-of-concept 25.6T CPO switch product Currently qualifying and ramping second generation 51.2T CPO switch product Demonstrated AI ASIC+CPO functionality:CPO+2.5D PackagingWhat I will share today Our journey to build

5、the first Co-Packaged Optics(CPO)deployed in datacenter Front-End and Back-End networks using high density Silicon Photonics(SiPh)Implication of CPO Platform on both scale-out and scale-up connectivityBroadcom Co-Packaged Optics(CPO)Background3Broadcom Proprietary and Confidential.Copyright 2023 Bro

6、adcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its subsidiaries.|Serdes Migration to 200Gbps Limits Electrical I/O Reach-25-20-15-10-50Losses(dB)ASIC Through SubstratePCB Trace Length LossesVia LossesPaddle Card Losses53 Gbps106 Gbps212 GbpsPCBBumpSubstrateDiePaddle CardBG