固态主动冷却有助于维持摩尔定律.pdf

1、AirJet:Solid-state active cooling helps maintain Moores LawHotChips 2024Moores Law Dead?Transistor counts increasingDie sizes are increasingPower/transistor is stallingTotal Heat is increasingThermal envelope of devices must increase to maintain Moores LawWThe AI RevolutionDemand for AI Computing es

2、timated to increase by over 300%by 2030Requires increased performanceIncreasing HeatOn-Device AITabletsNoteBooksSmartphonesCamerasAR|VRMini PCsCopilotPhoto Realistic GamingIntelligent Video Editing and Image De-noisingReal Time Video conferencing with Real-time Translation and TranscriptionFacial Re

3、cognitionIndustrial ManufacturingSmart RetailSmart CityPredict Maintenance,Remote MonitoringAutomation,Robots,Asset ManagementConnected Public Transport and Traffic ManagementVideo Surveillance Smart Shelves,Inventory ManagementAutomated CheckoutWithout adequate cooling Edge devices will not be able

4、 to run AI applicationsThis is Just the Tip of the Iceberg!Inadequate Existing Thermal Solutions TabletsFan-less NoteBooksSmartphonesSmart CamerasVRFan-lessMini PCsEmploy conduction and radiation to the environmentCompact,thin device,highly packed with no space for fansThermal envelope limited to 5-

5、10WPassively CooledGamingNoteBooksIndustrial PCsEmploy heatsinks,heat pipes,fans,and blowersBulky,noisy,heavy,reliability concernsThermal envelope:15-35WActively CooledStreamingDevicesWhat is the Ideal Thermal Solution?High rate of heat removalThinLightSilentOperate effectively in densely packed com

6、pact devicesDust proofWaterproof(IP68)compatibleReliableScalableMarket Requirement Document for Frore Systems 5 years ago!Introducing AirJet MiniSolid-State Active Cooling Chip based on MEMS Technology Heat Removal 5.25 WBack Pressure 1750 PascalsMax Power Consumed 1 WWeight 7gMaking Devices:Faster|