在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由.pdf

1、INNOVATIVE TECHNOLOGIES SUDDEN SERVICE GLOBAL REACHOptimizing Data Routing via Copper&Optical Interconnects in Scalable AI Hardware ArchitecturesMatthew BurnsGlobal Director,Technical MarketingSeptember 10,2024Samtec ConfidentialOptimized Data Routing-How?1.21 GW!224 Gbps/SIFabricsDisaggregationTher

2、mal ReliefScalabilityMemoryAccessOpticsSamtec ConfidentialKey AI Hardware ApplicationsCHIPSETSSoMs/CoMsACCELERATORSDSAsSamtec ConfidentialAI Chipsets/Characterization PlatformsA number of emerging AI chipset options from a variety of suppliersSoCs,CPU,GPU,TPU,Digital Compute,Analog Compute,etc.Fine-

3、tuned for training or inference whether at edge or in the data centerAI system development typically links AI chipset development boards mimicking end applicationsAI chipset I/O expansion opportunities aboundSamtec ConfidentialSamtec Bulls Eye High-Performance TestThe high-density array designs and

4、advanced cabling solutions support T&M applications to 70 GHz90 GHz solutions in developmentCompression interface provides easy mating/unmating and eliminates soldering costsHigh-density,space-saving designEnables smaller eval boards and shorter trace lengthsIdeal for testing the latest AI chipsets

5、capable of 224 Gbps PAM4Bulls EyeBulls Eye Enables smaller evaluation boards&shorter trace lengthsTraditional with SMAsTraditional with SMAsSamtec ConfidentialBulls Eye Case StudySamtec ConfidentialAI SoMs/CoMsComplete compute system on a single PCBASIC,RAM,I/O,peripherals,etc.System I/O and periphe

6、rals routed via connectors to carrier board/baseboardProvides a path from prototype to productionAI systems can consist of multiple SoMs/CoMsNew SoMs/CoMs feature increased speed and density in small footprintsSamtec ConfidentialHigh-Density Slim Body ArraysUp to 400 I/Os in a 4-row,open-pin-field d