華虹半導體：2023年年度報告.pdf

1、HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:01347)（股份代號：01347）（於香港註冊成立之有限公司）年度報告ANNUAL REPORT2023CONTENTSDefinitions2Key Financials7Letter to Shareholders8Corporate Information10Directors and Senior Management Team13Corporate Governance Report

2、23Directors Report352023 Environmental,Social and Governance Report68Independent Auditors Report271Consolidated Statement of Profit or Loss279Consolidated Statement of Comprehensive Income280Consolidated Statement of Financial Position281Consolidated Statement of Changes in Equity283Consolidated Sta

3、tement of Cash Flows285Notes to Financial Statements287Five Year Financial Summary3922HUA HONG SEMICONDUCTOR LIMITED 2023 ANNUAL REPORTDEFINITIONSIn this annual report,unless otherwise required by the context,the following terms shall have the meanings set out below.“Annual General Meeting”or “AGM”a

4、n annual general meeting of the Company to be held on 9 May 2024;“Articles”the articles of association of the Company(as amended from time to time);“Audit Committee”the audit committee of the Board;“Board”the Board of Directors of the Company;“China IC Fund”China Integrated Circuit Industry Investme

5、nt Fund Co.,Ltd.*(國家集成電路產業投資基金股份有限公司),a company incorporated in the PRC on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain financial institutions and private enterprises.It mainl

6、y focuses on the manufacturing of semiconductor wafers and takes into account the upstream and downstream links covering chip design,package test,equipment and materials etc;“China IC Fund II”China Integrated Circuit Industry Investment Fund(Phase II)Co.,Ltd.*(國家集成電路產業投資基金二期股份有限公司),a company establi