華虹半導體：2022年年度報告.pdf

1、年度報告A NNUA L R E P O R T2022HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:1347)（股份代號：1347）（於香港註冊成立之有限公司）華彩芯未來 Empoweringthe Information AgeCONTENTS華彩芯未來 Empoweringthe Information AgeDefinitions2Key Financials6Letter to Shareholders7Corporate Inf

2、ormation9Directors and Senior Management Team12Corporate Governance Report19Directors Report292022 Environmental,Social and Governance Report59Independent Auditors Report221Consolidated Statement of Profit or Loss229Consolidated Statement of Comprehensive Income230Consolidated Statement of Financial

3、 Position231Consolidated Statement of Changes in Equity233Consolidated Statement of Cash Flows235Notes to Financial Statements237Five Year Financial Summary348HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 2022 ANNUAL REPORT 2022 年度報告2DEFINITIONSIn this annual report,unless otherwise required by the conte

4、xt,the following terms shall have the meanings set out below.“Annual General Meeting”or “AGM”an annual general meeting of the Company to be held on 11 May 2023;“Audit Committee”the audit committee of the Board;“Board”the Board of Directors of the Company;“China IC Fund”China Integrated Circuit Indus

5、try Investment Fund Co.,Ltd.*(國家集成電路產業投資基金股份有限公司),a company incorporated in the PRC on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain financial institutions and private enterpri

6、ses.It mainly focuses on the manufacturing of semiconductor wafers and takes into account the upstream and downstream links covering chip design,package test,equipment and materials etc;“China IC Fund II”China Integrated Circuit Industry Investment Fund(Phase II)Co.,Ltd.*(國家集成電路產業投資基金二期股份有限公司),a com