Dielectric Cold Plate based Modular Data Center.pdf

1、Reviewing science and engineering behind Two Phase Cold plate Direct-on-Chip Cooling,examining its potential in real-world implementations,specifically in the modular data-centers market.Dielectric Cold Plate based Modular data CenterShahar Belkin,EVP Product,ZutaCore Ltd.Dielectric Cold Plate based

2、 Modular data CenterPOWER AND COOLINGDC FACILITIESZutaCore has participated in several OCP cooling environment projects,which aim at creating open specifications and standardization to enable interoperability of non-proprietary,multi-vendor supply chain of liquid cooled solution:Cold plate project,w

3、hich generates an open specification and supporting documents focusing on standardization and definition of critical interfaces,operational parameters,and more.Door Heat Exchanger project which generates Specs,standards,and products that support Rack System Architectures such as 19”EIA Compatible,21

4、”Open Rack and Rack-Level Power Systems.Heat reuse project,which its goal is to suggest solutions to allow easier implementations of technologies aimed at harnessing the heat and turn it into profit instead of a cost.This fruitful exchange of knowledge and brainstorming have inspired the creation of

5、 a whitepaper that was published on the OCP website,exploring the benefits that can be achieved by integrating dielectric cold plates and rear door heat exchangers in a modular data center.BackgroundThere is a need to enable the relentless progression of computing power while simultaneously reducing

6、 environmental impact and minimizing physical size through improved efficiency and heat reuse.This presentation will review the potential of Two-Phase Cold plate Direct-on-Chip Cooling in real-world implementations to enable such improved efficiency and heat reuse,specifically in a modular data-cent