Why chiplet will transform the semiconductor ecosystem from design to packaging.pdf

1、In the last 5 years,we have witnessed worldwide efforts to develop innovative integration solutions that respond to the needs of power-efficient high-performance computing at cost compatible with the semiconductor industry.Chiplet enable the integration of specialized components,such as high-speed i

2、nterconnects,memory,and accelerators,leading to improved system-level performance and efficiency.Fueled by the fast adoption of generative AI,2.5D/3D architectures,the industry has geared up to chiplet adoption for years and has step by step removed the technical obstacles.Its not only about increas

3、ing computing performance in making CPU/GPU closer to the HBM memory through a silicon interposer,this has also been already available on the market for more than 10 years,but offering flexibility,modularity and re-use in design to achieve the most performant system.This presentation will make a ret

4、rospective of the emergence of chiplet in datacenters and consumer markets and draw the outlines of its widest adoption in the coming years.Why chiplet will transform the semiconductor ecosystem from design to packaging?Emilie JOLIVET,More Moore business line director,Yole Group Why chiplet will tra

5、nsform the semiconductor ecosystem from design to packaging?SUSTAINABLE SCALABLE COMPUTATIONAL INFRASTRUCTUREOPEN CHIPLETThe explosion of generative AI applications,such as ChatGPT and Dall-E,combines the trend of exponential model size growth with massive acceleration of user demand.As such,the com

6、puting hardware requirements for these generative AI applications are substantial,with an acute impact to GPUs.For training on GPT-3 with 175 billion parameters,for example,we estimate that between 6,000 and 8,000 A100 GPUs would have required up to a month to complete.There are dozens of other LLMs