基于高密度、低功耗Micro-LED的光学互连器件用于芯片间通信.pdf

1、OCP Global Summit October 18,2023|San Jose,CAEmad AfifiDir.ASIC DesignAvicenaUltra low-power,multi-Terabit LED interconnects for chip-to-chip communications3 Main ChallengesICT energy consumption is hugeICT is to consume 20%of Global Energy by 2030Most of this is used in moving dataData connections

2、are choking ICsFLOPS has improved faster than BWHigh Speed SerDes are a painLatencyExpensive process nodesConsume real-estateThe world needs low power,low cost,simple,PARALLEL interconnectsLeveraging LED Display and Lighting Industry4Contact lens display:14000 PPI display,0.5mm acrossDisplay on CMOS

3、Large array transferred to substrateMassive GaN lighting industryMassive upcoming GaN uLED display production volumes oApple,SamsungoTransferring/assembling uLEDs onto silicon backplaneo3 million optical devices working on silicon chips!Laser lift-off system for transferring GaN LEDsuLEDs have treme

4、ndous consumer promiseLightBundleTMTechnology ElementsLightBundle ASICActual LightBundle chiplet layout4.1mmLED ArrayFinal AssemblyLink:MultiFiber CableMultimode fiber cable with 100s of coresChoice of glass or plastic fiberVery low optical crosstalkMeasured cross-talkbetween adjacent coresis better

5、 than 27dBHexagonal packing results in excellent fiber positioning accuracy MicroLED(LED)links:superior power x densityKey figure of merit(FOM):Energy efficiency(pJ/bit)x BW density(Gb/s/mm)A new frontier of efficiency x density“Kyoto”transceiver ICSi PD array bonded to ICLED array bonded to ICOHBI

6、D2D interfaceTSMC N16 process304 LEDs on 50m grid304 PDs on 50m gridMicrolens arrays on LED and PD arrays to maximize fiber coupling 1.2Tbps(4Gbps/channel x 304 channels)Target link power 4 GHzLED4Gb/s eye from Kyoto TxVery low capacitance(10fF)lateral PDs ena