A Chiplet Reference Platform Utilizing OCP Bunch-of-Wires.pdf

1、A Chiplet Reference Platform Utilizing OCP Bunch-of-WiresChipletsA Chiplet Reference Platform Utilizing OCP Bunch-of-WiresAndy Heinig,Head of Department Efficient ElectronicsFabian Hopsch,Advanced System IntegrationPresentation Starts HereTechnical content is desiredOpen,collaborative in nature,mate

2、rial must be relevant to an open-source communityMust not be a product advertisement or too“commercial”in the messagingProducts,Specs,and any contributions that have NOT been previously discussed in a monthly call,workshop,or previously approved by the foundation should NOT be disclosed in an engine

3、ering workshop.No future discussions about contributions without a Contribution License Agreement in placePresentation Starts HereTechnical content is desiredOpen,collaborative in nature,material must be relevant to an open-source communityMust not be a product advertisement or too“commercial”in the

4、 messagingProducts,Specs,and any contributions that have NOT been previously discussed in a monthly call,workshop,or previously approved by the foundation should NOT be disclosed in an engineering workshop.No future discussions about contributions without a Contribution License Agreement in placeBui

5、lding a Chiplet Ecosystem Work for youCollaborate:Samsung,Cadence&FraunhoferWorking with YOU!5Innovate:Silicon Proven HPC/ChipletDevelopment Platform Silicon&SW Customized for you specific needs Grow:Accelerate Designs and Build Products Faster with lower Costs and RiskNNA110(x2)PCIe6LX-SSVQ8(2MC)NX

6、MemDDR5BoWD2DBoW Chiplet PlatformVQ8(2MC)BoW-Bunch of Wires:Industry standard D2D interfaceFraunhofers Design Strength and Capabilities Worlds leading organization for applied researchIdentification of newest research results for next generation customer productsDesign and manufacturing of customer-