1、Viability studyDirect liquid cooling for Open Edge serversEdgeDirect liquid cooling for Open Edge servers Viability studySamuli Toivola,Lead HW Architect,NokiaDirect liquid cooling for Open Edge serversThe viability of using cold plates coupled with pumped liquid cooling is proposed to cool the Open
2、 Edge server CPU,which is the component with the highest cooling demand,analyzing the required design modifications to the server sled and to the OE chassis.The results obtained from this viability study show that the adoption of direct liquid cooling in the OE servers may be a potential configurati
3、on in challenging far edge scenarios,further improving the cooling capacity of these servers and increasing its energy efficiency.With this presentation Nokia also aims to foster collaborations in developing future specifications of advanced cooling solution for the Open Edge platform.Key cooling op
4、erating conditions:Operating temperature range from -5 to 55C Operating relative humidity from 5%to 95%Open Edge cooling design specificationsAirflow of 100 CFM for the 1U server sled,and 160 CFM for the 2U server sled,with fans at maximum speedBoth front-to-rear and rear-to-front airflow options ar
5、e supportedFan controls adapt to the environmental conditions,providing adequate cooling with minimum power fan power consumptionThe sled can tolerate failure of a single fan rotorPower budget for the 1U server sled is 500 W,and for the 2U server sled is 800 WMaximum power levels for PCIe cards of 1
6、00 W in 1U,and up to 300 W in 2UOpen Edge Cooling Present Open edge 1U server sledOpen edge server chassis Presently air heat transfer cooling is the dominant form of cooling for ITE,this technology has intrinsic physics limitations due to airs heat transfer properties.To increase heat densities the