1SpecialPresentation3_Schaevitz.PPTX

1、Scaling into the Next DecadeRebecca K.Schaevitz,PhDBroadcom Optical Systems Division2Long-haul80 kmDirect Attach Copper Cable(2m)Active Optical Cable(30m)Parallel Single-mode Fiber(2 km)Duplex&ParallelSingle-mode Fiber(80 km)OpticalElectrical3DFE deci si on f eedback equal i zerFFE f eed f or war d

2、equal i zerDSP di gi t al si gnal pr ocessorMLSE maxi mum l i kel i hood sequence est i mat i on equal i zerI L i nser t i on l ossDAC di r ect at t ach copper cabl eOBO on-boar d opt i csBOW/D2D bunch of wi r es/di e t o di eXSR ext r emel y shor t r eachVSR ver y shor t r eachLR l ong r eachCPO co

3、-packaged opt i csFPP f acepl at e pl uggabl e4Engineering and manufacturing limits to scaleCONVENTIONAL MODULE DESIGNModule Integration=First step to improved scaleINTEGRATED MODULE DESIGN BASED W/SCIPHighly Integrated Optical Engines(3.2T to 6.4T)CO-PACKAGED OPTICS30%fewer Piece Parts!SiPh Chiplet

4、s in Package(SCIP)Fiber JumperPhy IChttps:/ TYPERELATIVE COSTDACAOCPSMRELATIVE COSTS OF COPPER VS OPTICS(TODAY)CapEx GulfUn-retimed copper(DAC)is simpleDAC cost significantly lower than alternativesCopper challenged as data rates increaseAdvanced photonic integration narrows gapCo-packaging drives O

5、pEx efficienciesLower power consumptionExpected higher reliability Reduced operational burdenAssessing TCO for Optics is Complex6Who Does What?Co-packagingOpticsFiberASICPCBOpticsFiberASICPCBElectrical7Co-PackagingIntegration of multiple dies on a common package substrateHigh volume use cases today

6、like HBM*Source:Image,AMD,https:/ Source:Yole Developpement,http:/www.yole.fr/3D_25D_Stacking_Technologies_IntelEMIB.aspx#.YJyx7pNKh25 Co-Packaged OpticsIntegration of optical engines on a common package substrateObjective:alleviate the“interconnect density bo