Hot Chips_Pat Keynote_Presentation_08-18-22.pdf

1、Pat Gelsinger,Intel CEOHot Chips 2022CHIPS for America Act“Since semiconductors are such key components,the fragile supply chain for semiconductors puts virtuallyevery sector of the economy at risk of disruption.”-Department of Commerces E.O.14017 industrial base reviewTechSuperpowersUbiquitousConne

2、ctInfrastructureComputeArtificial Intelligence1970198019902000201020202030Transistors Per Package(log)From a 100B transistors todayaspiring to 1 Trillion transistors in 2030Moores Law Alive and WellFuture projections based on products still in design.Future transistor counts are projections and are

3、inherently uncertainWe will not rest until the periodic table is exhausted“It may prove to be more economical to build large systems out of smaller functions,which are separately packaged and interconnected1.”-Gordon E.MooreImage:Intel1.“Cramming more components onto integrated circuits”,Electronics

4、,Volume 38,Number 8,April 19,1965*Graphic is for illustrative purposes only and is not to scalePackage main function:provide power and signaling from motherboard to dieAdded Package value:high density interconnects that enable larger die complexes from multiple process nodestimeLeadframe/WirebondFli

5、p Chip CeramicFlip Chip Organic&Multi Chip Pkg2.5DEMIB3DFoveros2.5D EMIB+3D Foveros3D Foveros Direct&OmniXeon CoresXeon CoresHigh-Speed Standardized Chip-to-Chip Interface(UCIe)Advanced 3D PackagingCustomer IP and Customized Chiplets20X I/O Performance at 1/20thPower*x86*relative to PCIe G5 x16White

6、 Paper:Universal ChipletInterconnect Express(UCIe):Building an open chipletecosystem,Dr.DebendraDas Sharma,Intel Senior Fellow and Chief Architect,I/O Technologies and Standards Promoter Member of UCIeSolutionSiliconSoftware&SaaS“Software is the soul of the ma