1、The New Frontier of Microelectronics The world doesnt just need more chips.It needs smarter packaging.Traditional Chip(2D)Advanced&Specialty Packaging(ASP)Moores Law isslowing:We cantjust keep makingchips smaller.The Solution:Integrating diversecomponents into asingle,vertical package.The Opportunit
2、y:TheU.S.must capture thiscritical market.Uniquely Florida:The High-Reliability Niche Space&Aerospace Defense Systems Medical Technology We are the global leader in High-Mix,Low-Volume,High-Reliability.Our heritage is building systems where failure is not an option.This requires specialized chips th
3、at survive extreme environments.Enter the Florida Semiconductor Engine(FSE)State of FloridaNanotechnology Research University of Florida University of South Florida Industry Partners Florida Polytechnic UniversityFlorida International University/0 Mission:To transform Florida into a global leader in
4、 Advanced and Specialty Packaging(ASP)by unifying the regions assets.Role:FSE is the System Integrator:aligning research,industry,and workforce into a cohesive engine.University of Central Florida The Five Roles of the Engine Source of Credibility Validating technology for global markets.Conduit Con
5、necting research to manufacturing.Investor Funding critical R&D.Mentor Guiding startups through the Valley of Death.Convener Bringing stakeholders to the table.Areas of Focus:Technology&Innovation Advanced Packaging Integrating chips for higher performance.Material Innovation Developing new inputs f
6、or faster data transfer.ilili i 1111111 1111111 lllll Digital Twins Simulating designs virtually before building.Thermal Management Keeping powerful chips cool and efficient.Bridging the Lab-to-Fab Gap 0 University Lab/IP The Solution:Infrastructure and prototyping to prove manuf