1、13.05.20251SilOriX-efficient connections Silicon-organic hybrid electro-optic modulators for next generation optical interconnectsC.Eschenbaum,SilOriX GmbH Scalability Challenges in Artificial Intelligence Artificial intelligence(AI)Outpacing any known scaling laws in information and communication t
2、echnology.Interconnects limit scaling of AI clusters Electro-optic modulators are major bottleneck for interconnectsElectro-optic modulator requirements:Compact:Sub-1 mm Efficient:Ideally sub-1 V operation High-speed:Ideally 400 Gbit/s per with IMDD Scalable manufacturing:Silicon photonics13.05.2025
3、2SilOriX-efficient connections GPT-1GPT-2GPT-3GPT-4AI model size:400 in 2y(Parameter count)1.6T800G400G200G40G100G10GDeepseekR10000H100GTX 580V100Organic Electro-Optic Material13.05.20253SilOriX-efficient connections Electro-optic molecules Material-efficient solution processes(e.g.inkjet printing)H
4、igh-performance(r33beyond 100 pm/V)Tailor-made materials for various applicationsPoled state:Competing statesDipole-dipole electrostatic interaction:Kieninger et.al.,Optica 5,739-748(2018)SOH Technology13.05.20254SilOriX-efficient connections Concept:Combine silicon-on-insulator waveguides with orga
5、nic electro-optic cladding material High-performance:r33=390 pm/V,UL 0.3 Vmm Energy-efficient:100 GHz,aFCA 0.2 dB13.05.202512SilOriX-efficient connections Driver-Less Operation1313.05.2025SilOriX-efficient connections CMOS-TxCMOS-RxLaserPDSilOriX SOH-MZM 0.5 Vpp 112 Gbit/s PAM4 data transmission Dri
6、ver-less operation at CMOS-compatible voltage swings below 0.5 VSchwarzenberger et al.OFC 2024 M3K.6528 Gbit/s412.5 Gbit/sC-Band Data Communication Experiment13.05.202514SilOriX-efficient connections Schwarzenberger et al.OFC 2025 M3K.6O-Ba