隆重推出 HIGHER 项目；这是一种利用 OCP 标准实现真正硬件模块化的欧洲数据中心就绪技术方案.pdf

1、Vincent Casillas,VP of R&D,SiPearlTim Lewis,CTO,Insyde SoftwareIntroducing the HIGHER Project a European Data Center-ready Technologies approach to True Hardware Modularity leveraging OCP StandardsIntroducing the HIGHER Project a European Data Center-ready Technologies approachto True Hardware Modul

2、arity leveraging OCP StandardsVincent Casillas,VP of R&D,SiPearlTim Lewis,CTO,Insyde SoftwareIT INFRASTRUCTURESiPearl in a nutshellBuilding European high-performance energy-efficient processorsfor supercomputing and AI IncorporatedIn June 2019FundedBy the European UnionArm architectureEnergy-efficie

3、ncy and mature ecosystemIdentified customersServer manufacturers basedon user specifications:First,EuroHPC ecosystem before going globalFinancingSeries-A to date:113mKey partnershipsJoint-offering with200 employeesfrom1stdesign winJUPITER,1stEuropean exascalesupercomputer,financed by EuroHPC&operate

4、d by Forschungszentrum JlichInsyde Software OverviewWorld HQ in Taiwan,Major Operations Worldwide25+Years as an Industry FirmwareLeaderData Center,AI,Cloud&HPCIoT,Embedded,&EdgeClientComputingEngineering ServicesThe HIGHER Project is developing Europes first datacenter-ready processors and managemen

5、t modules for cloud and edge infrastructures using European technologies and OCP specifications.We share our journey of open collaboration with OCP MHS,OAI,and DC-SCM standards,integrating Arm-based and RISC-Vbased server management modules with advancedAI/HPC acceleration.Introducing Project HIGHER

6、Project Higher ConsortiumFrom cloud to edge with HW and SW modules based on European Technologies demonstrating full computing infrastructure deployments.Project statementProcessing and Energy efficiency able to satisfy the needs of demanding cloud and edge applications.Can we design and build data-