Forum 1 Unlocking Innovation Circuit Techniques and New Approaches for Die-to-Die Links and the Chiplet Ecosystem.pdf

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1、ISSCC2025Forum1UnlockingInnovation:CircuitTechniquesandNewApproachesforDie-to-DieLinksandtheChipletEcosystemForum 1Unlocking Innovation:Circuit Techniques and New Approaches for Die-to-Die Links and the Chiplet EcosystemInternational Solid State Circuit ConferenceFebruary 16th,2025Start of presentat

2、ions at 8:15amISSCC 20251 of 5 2025 IEEE International Solid-State Circuits ConferenceHosted by the Wireline,DAS and MEM Subcommittees Organizers:Zeynep Toprak Deniz,IBM Research,Yorktown Heights,NY Didem Turker Melek,Cadence Design Systems,San Jose,CA Committee:Juang-Ying Chueh,Etron Technology,Tai

3、pei,TaiwanKenny Hsieh,TSMC,Hsinchu,TaiwanShidhartha Das,Advanced Micro Devices,Cambridge,United KingdomTamer Ali,Mediatek,Irvine,CA Champions:Wei-Zen Chen,National Yang Ming Chiao Tung University,TaiwanBill Redman-White,Top-IC,Southampton,United KingdomOrganizing Committee2 of 5ISSCC 2025-Forum 1:Un

4、locking Innovation:Circuit Techniques and New Approaches for Die-to-Die Links and the Chiplet Ecosystem 2025 IEEE International Solid-State Circuits Conference9 talks38 minutes talk will be followed by 7 minutes Q&A period2 coffee breaks and one lunch breakElectronic copies for Forums are available

5、for downloadPlease switch your mobile devices to muteTaking pictures and videos is not allowedPlease remember to fill out speaker evaluation using the ISSCC appNo panel session at the end of the ForumGeneral Information 3 of 5ISSCC 2025-Forum 1:Unlocking Innovation:Circuit Techniques and New Approac

6、hes for Die-to-Die Links and the Chiplet Ecosystem 2025 IEEE International Solid-State Circuits ConferenceAgenda4 of 5StartTitleSpeakerAffiliation8:15 AMIntroductionZeynep Toprak DenizIBM Research8:25 AMThe Business of Making Chiplets and Associated SystemsAnu RamamurthyOpen Compute Project Foundati