Chiplet based Reconfigurable OCP Accelerator Module (OAM) architecture and platform.pdf

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1、In this talk,we will expand on a previous talk(see link)and outline a chiplet based Reconfigurable Open Compute Accelerator Module(ROAM)platform.In OAI,reuse,scalability,and modularity of hardware is defined up until the OAM.This new platform leverages existing OAI infrastructure and extends this in

2、to advanced packaging and chiplets.We will outline the specifics of a System in Package(SiP)which includes a standard footprint for attaching the SiP to the ROAM base board.The SiP will also have standard footprints to house up to 8 domain specific accelerators(DSA)chiplets,IO chiplets,and hub/bridg

3、e/switch chiplets.Standardization of the chiplet footprints enables a highly modular,scalable,ROAM platform.Furthermore,it enables innovation in DSA offerings by providing clear power,(performance),and area specifications.This platform has the potential to usher in the era of Plug and Plug Chiplets(

4、PnPC).High degree of composability enables targeted microservices.Chiplet Based Reconfigurable OAM Architecture and Pla:ormSuresh Subramaniam,Ph.D.Founder,XYZ ChipsChiplet Based Reconfigurable OAM Architecture and Pla:ormSUSTAINABLE SCALABLE COMPUTATIONAL INFRASTRUCTURESUSTAINABILITYBrief Overview o

5、f OAI,UBB,OAMIntroduce ROAMWhat about Memory?SummaryAgendaGlossary of TermsD2D Die to DieAPI ApplicaOon Programming InterfaceUBB Universal Base BoardOAM Open Compute Accelerator ModuleROAM Reconfigurable OAMSiP-System in PackageDSA Domain Specific AcceleratorOAI Open Compute Accelerator Infrastructu

6、rexPU -any compute chiplet CMM CXL Memory ModuleCPO Co-Packaged OpOcsTTM Time to MarketNRE Non-recurring Engineering CostsOAI,UBB,OAM brief reviewLarge OAI EcosystemSource:OAI presenta1onSystem Integrator SoluIons with OAMsSource:OAI presentationUniversal Base Board (UBB)Source:UBB presenta1onUBB Ac