SNIA-SDC23-Johnson-Maximizing-EDSFF-E3-SSD-Design_1.pdf

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1、1|2023 SNIA.All Rights Reserved.Virtual ConferenceSeptember 28-29,2021Maximizing EDSFF E3 SSD DesignTrent Johnson FlashCore Hardware A2|2023 SNIA.All Rights Reserved.2023 IBM CorporationTrent Johnson is a Hardware Architect at IBM,with a focus on the IBM FlashCore Module.He joined IBM as part of the

2、 Cleversafe Acquisition where he was the System Hardware Architect of exabyte-scale Object Storage.Prior to Cleversafe,he developed system-level manufacturing and test solutions for AMD CPUs and GPUs where he was awarded the AMD Corporate Technical Achievement Award.He has 24 years of industry exper

3、ience,holds 7 US patents and has presented at the Burn-in and Test Socket Workshop,Flash Memory Summit as well as the Conference for Consumer Electronics.He earned BSEE and MSEE degrees from The University of Texas at Austin in Electrical Engineering with a focus on Manufacturing System Engineering.

4、3|2023 SNIA.All Rights Reserved.2023 IBM CorporationWhy migrate to EDSFF?4|2023 SNIA.All Rights Reserved.2023 IBM Corporation Connector Good for high amperage Low cost on card High Speed by design PCIe 5.0/6.0 Very high lane counts(up to 16)Thermal Architecture Each Form Factor has realistic and ach

5、ievable thermal performance targets Density is foremost in the standard Generous device power budgets Device Flexibility Its a“Standard”form factor,not SSD form factor Peripherals of almost any kind may be usedKey Benefits of Enterprise Datacenter Standard Form Factor(EDSFF)Relevant Specs:SFF-TA-100

6、2(Connector)SFF-TA-1008(Mechanical)SFF-TA-1009(Electrical)SFF-TA-1023(Thermal)5|2023 SNIA.All Rights Reserved.2023 IBM CorporationIBM FlashSystemHigh-End:FlashSystem 9500Mid-Range:FlashSystem 7300Entry-Level:FlashSystem 5200IBM FlashCore Module NVMe SSDEnterprise QLC storageCompression at speedEncry