DCON26_SLIDES_Track14_HolisticDesignOptimizationof3D-ICPackageSubstrateInterconnectionsinMultiplePowerDomai_197_108.pdf

1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,20261Holistic Design Optimization of 3D-IC Package Substrate Interconnections in Multiple Power Domain Environments based on Hierarchical Reinforcement Learning2Speaker:Seunghun Ryu,(KAIST)Seonghi Lee(KAIST),Dongry

2、ul Park(KAIST),Sanguk Lee(KAIST),Hyunwoo Kim(KAIST),Jinwook Lee(KAIST),Seongho Woo(Keimyung University),Seokbeom Yong(Samsung Electronics),Sangsub Song(Samsung Electronics),Hongseok Kim(CPS Tech,Inc.),Jiseong Kim(KAIST),Seungyoung Ahn(KAIST)SPEAKERS3Seunghun RyuPh.D Student,Korea Advanced Institute

3、of Science and Technology(KAIST)ysh0067kaist.ac.krSeunghun Ryu received the M.S.degree from The Cho Chun Shik Graduate School of Mobility,Korea Advanced Institute of Science and Technology(KAIST),Daejeon,South Korea,in 2022,where he is currently pursuing the Ph.D.degree.In 2022,he was a visiting sch

4、olar at Missouri University of Science and Technology,Rolla,MO.Research interest:High-speed interconnection design,machine learning-based power integrity design optimization for 2.5D/3D ICsContents4I.IntroductionII.Hierarchical Reinforcement Learning FrameworkIII.Analytical Modeling of the Package S

5、ubstrateIV.Verification of Proposed MethodV.ConclusionContents5I.IntroductionII.Hierarchical Reinforcement Learning FrameworkIII.Analytical Modeling of the Package SubstrateIV.Verification of Proposed MethodV.ConclusionMobile APs integrate diverse functions such as CPU,GPU,NPU,modem,and security int

6、o a highly compact footprint,inherently leading to complex challenges in thermal,power,and signal integrity.High Fucntional Density of Mobile AP6DSPVideoEncoder/DecoderCPUMemoryMemoryMemorySLCNPUISP5G ModemMemoryWiFiWGPGPU9.69 mm10.80 mmCPUOS execution,real-time schedulingGPUUI rendering,3D gameISPS