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DCON26_PAPER_Track01_IBIS-AMIModellingMethodologyforSimultaneousBi-DirectionalSBDDie-to-DieChipletConnectiv_214_6.pdf

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1、 IBIS-AMI Modeling Methodology for Simultaneous Bi-Directional(SBD)Die-to-Die Chiplet Connectivity Arpit Kothari,Eliyan C Mohammad Mahani,Eliyan C Ali Khoshniat,Eliyan C Abstract Simultaneous Bi-Directional(SBD)signaling is an innovative scheme for die-to-die chiplet interconnects aiming at solving

2、one of the biggest challenges that our industry faces:the ability to process massive amounts of data with the highest efficiency and the lowest power consumption.SBD architecture contains a transmitter-receiver combo at each end of the channel operating simultaneously.This paper presents the first i

3、ndustry attempt at developing a methodology to use IBIS-AMI models for analyzing single-ended SBD links.Since IBIS-AMI models only support communication in one direction,a novel approach is presented that captures the important aspects of SBD operation while utilizing unidirectional models.Various o

4、perating scenarios are studied,and the models are shown to accurately predict the behavior of the system.Author(s)Biography Arpit Kothari received a BE degree in Instrumentation Technology from Visvesvaraya Technological University,Belgaum,India,in 2007,and MS degree in Electrical Engineering from M

5、issouri University of Science and Technology(Missouri S&T),Rolla.in 2013.His prior work experience includes Cisco Systems,Juniper Networks(now part of HP enterprise)and Palo Alto Networks.Currently he is working as a Principal Engineer at Eliyan Corp.specializing in Signal and Power Integrity.Mohamm

6、ad Shahidzadeh Mahani received his B.Sc and M.Sc degrees from Iran University of Science and Technology in Iran and his Ph.D.from McGill University,Canada all in electrical engineering.He was the recipient of McGill Engineering Doctoral Award.His previous experience includes Analog/Mixed-Signal desi

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1. **SBD技术优势**:Simultaneous Bi-Directional (SBD) signaling通过双向同时传输,在不增加物理连接的情况下将带宽密度翻倍,适用于die-to-die chiplet互连(如UCIe、BoW标准),解决高带宽、低功耗需求。 2. **建模挑战**:传统IBIS-AMI模型仅支持单向通信,无法直接模拟SBD系统的本地发射器回波(echo)与远端信号叠加问题。 3. **创新方法**:提出分解-叠加法,将SBD系统拆分为三个单向路径(主路径、回波路径、回波抵消路径),分别用IBIS-AMI模拟后时域叠加,重建完整SBD行为。 4. **验证结果**:在32 Gbps/方向(64 Gbps聚合)下,该方法与SPICE仿真高度一致,证明其准确性和实用性,且无需修改EDA工具。 5. **应用价值**:为SBD链路提供高效系统级分析,加速chiplet架构设计,支持多厂商生态系统互操作性。
**SBD如何建模?** **SBD有何优势?** **SBD如何实现?**
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