DCON26_PAPER_Track01_DistributedCapacitorCharacterizationforAdvancedPackaging_143_3.pdf

1、 Information Classification:General Distributed Capacitor Characterization for Advanced Packaging Sivaseetharaman Pandi,Amazon Uday Raj Shakelli,Amazon Gustavo Blando,Amazon Istvan Novak,SAMTEC Information Classification:General Abstract Distributed capacitors play a crucial role in ensuring power i

2、ntegrity in modern GPUs,which demand high current delivery and minimal voltage ripple at ever-increasing switching speeds.As GPUs become more power-hungry and densely packed with cores,maintaining stable voltage across all functional blocks is vital to avoid performance throttling and logic errors.T

3、his work presents comprehensive circuit and behavioral modeling of distributed capacitors commonly employed in advanced packaging applications,specifically focusing on deep trench capacitors and metal-insulator-metal(MIM)capacitors used for power delivery network decoupling.A systematic modeling app

4、roach was developed to capture the electrical characteristics of these distributed capacitive structures,incorporating both lumped-element circuit representations and behavioral models that account for parasitic effects and non-ideal behaviors.The proposed models were extensively validated through c

5、orrelation with VNA measurements conducted across wide voltage and temperature ranges.Author(s)Biography Sivaseetharaman Pandi is a Senior Hardware Development Engineer at Annapurna labs,Amazon.He works on high-speed interconnects and power delivery in advanced packaging of GPUs for AI accelerators.

6、He earned his PhD in electrical engineering from Arizona State University.His research interests are IC packaging,Signal and Power Integrity.He holds 6 US patents in packaging in addition to several publications in Antennas,microwaves and SI/PI.Uday Raj Shakelli is a Sr.Hardware Dev Engineer at AWS