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DCON26_SLIDES_Track11_AHybridSystem-LevelModelingandSensitivityAnalysisApproachtoImproveICImmunityforInduct_269_130.pdf

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1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,20261A Hybrid System-Level Modeling and Sensitivity Analysis Approach to Improve IC Immunity for Inductive Position Sensors in Noisy Automotive EnvironmentSpeaker:Bhuvan Sai Lingam,(Simyog Technology Pvt.Ltd.)Autho

2、rs:Bhuvan Sai Lingam(Simyog Technology Pvt.Ltd.)Ganesh Shaga(Microchip India Technology Pvt.Ltd.)Mark Smith(Microchip Technology Inc.)Bibhu Prasad Nayak(Simyog Technology Pvt.Ltd.)2ImageSpeakerBhuvan Sai LingamApplication Engineer,Simyog Technology Pvt.L|Bhuvan Sai Lingam received his Bachelor of Te

3、chnology degree in Electronics and Communications from Amrita Vishwa Vidyapeetham,Coimbatore,Tamil Nadu,India,in 2022,and received his Master of Science degree in Electrical Engineering(Applied Electromagnetics)from the University of California,San Diego,USA,in 2024.He currently works at SimYog Tech

4、nology Pvt.Ltd.,Bengaluru,India,as an Application Engineer dedicated to solving automotive EMI/EMC issues.3Automotive EMC Compliance4Proliferation of Automotive Electronics5 Automotive electronics refers to electronic systems and components in vehicles for various purposes.Electronics is at the hear

5、t of the automotive industry “future of mobility”.The global automotive electronics market size estimate:USD 307.61 billion(2025),predicted to hit USD 647.43 billion(2034).What are the key drivers of this market?Source:https:/ of Automotive Electronics6Source:Slide from Rajen Murugan,IEEE EDAPS 2024

6、Automotive Systems-Safety Critical7 Immunity to EMI has become a serious aspect of automotive testing,with conformance to standardsmandated in most countries in the world.To comply with the current quality standards of the automotive industry,IC suppliers will need toadhere to more stringent EMC sta

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1. **会议与主题**:2026年2月24-26日圣克拉拉会议中心,演讲主题为通过混合系统级建模与灵敏度分析提升汽车电感式位置传感器在噪声环境中的IC抗扰性。 2. **行业背景**:全球汽车电子市场规模预计2025年达3076.1亿美元,2034年将增长至6474.3亿美元,EMC合规性成为关键挑战。 3. **核心问题**:首次EMC测试失败率高达50%,传统设计流程需多次迭代,而预测性建模可缩短周期并提升成功率。 4. **方法与工具**:采用BCI(ISO 11452-4)测试与ICIM模型(IEC 62433-4)结合,通过3D电磁-电路协同仿真分析噪声路径。 5. **关键发现**:灵敏度分析识别出RC滤波器电容C19为优化关键,调整其值可降低IC引脚电压,避免失效。 6. **结论**:该方法支持早期EMC优化,预测并缓解IC级失效,减少测试成本与时间。
**如何提升IC抗扰性?** **BCI测试关键点?** **敏感度分析应用?**
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