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DCON26_SLIDES_Track06_FastSignalIntegritySimulationOptimizationforLPDDR5xat10.7GbpsinAIPC_79_127.pdf

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1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,20261Fast Signal Integrity Simulation&Optimization for LPDDR5x at 10.7 Gbps in AIPCSpeaker,Feng Ling,(XPEEDIC)Zhijian Mo(Lenovo),Huaqiao Li(Lenovo),Zhengyi Zhu(Lenovo)Mingjie Fang(Lenovo),Guangmeng Ji(XPEEDIC),Yufe

2、ng Dan(XPEEDIC)2SPEAKERS3ImageFeng LingCEO,Xpeedic Technology,IFeng Ling is Founder and CEO of Xpeedic Technology,a leading EDA solution provider for chip-package-system designs.His twenty years industrial career spans from Motorola to EDA startups Neolinear(acquired by Cadence)and Physware(acquired

3、 by Mentor Graphics).In 2009,he founded Xpeedic Technology,continuing the efforts to bring the novel EDA solutions to the semiconductor industry.Dr.Ling received his Ph.D.degree in electrical engineering from the University of Illinois at Urbana-Champaign(UIUC)in 2000.4Outline Background Fast Signal

4、 Integrity Simulation of LPDDR5X Channels:Detailed Process OverviewDOE-Based Simulation MethodDOE Simulation FlowDOE-Based Optimization of LPDDR5X Channels PCB Design Optimization:Stack-up optimizationRouting layer optimization CCT-Based Optimization:CCT TheoryCCT Simulation FlowCCT-Based Channel Ev

5、aluation System validation result SummaryBackground 5Figure1 Memory bandwidth requirements of LLM workloadsFigure2 Trace width and trace spacingFigure3 Routing layer,via stub,and spacing between DRAM and CPUFast Signal Integrity Simulation of LPDDR5X Channels6When operating at 10.7 Gbps,LPDDR5X sign

6、als face severe signal integrity challenges:First,the very fast signal edge transitions introduce significant high-frequency spectral content,increasing sensitivity to loss and discontinuities.Second,the operating voltage swing is very small,with supply voltages around 1.05 V or lower,resulting in a

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1. **会议与主题**:2026年2月24-26日于圣克拉拉会议中心举办,主题为AIPC系统中LPDDR5x在10.7 Gbps下的快速信号完整性仿真与优化。 2. **核心挑战**:LPDDR5x信号在10.7 Gbps下面临高速边沿引入的高频损耗、低电压摆幅(≤1.05V)导致的噪声敏感度,以及极窄时序裕度(UI<94ps)问题。 3. **优化方法**: - **DOE仿真**:通过I-optimal设计和响应曲面法(RSM)识别关键参数,优化PCB叠层和布线层。 - **CCT评估**: thinner叠层减少串扰(XTK),L4布线层较L8显著提升眼高/眼宽。 4. **验证结果**:系统测试显示,10.7 Gbps信号时序与电压余量达标,仿真与实测结果高度一致,验证了方法论有效性。
**LPDDR5X如何优化?** **10.7Gbps信号挑战?** **DOE与CCT结合优势?**
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