DCON26_SLIDES_Track11_CharacterizationandSuppressionofRFICausedbyLPCAMM2StructuralResonanceinCompactLaptops_82_132.pdf

1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,2026 1Characterization and Suppression of RFI Caused by LPCAMM2 Structural Resonance in Compact LaptopsMinsu Lee,(SK hynix)Minsue Lee(SK hynix),Jeongho Ju(SK hynix),Seongho Ahn(SK hynix),Kihoon Kim(SK hynix),Wonhyu

2、n Son(SK hynix),Taeil Bae(SK hynix),Inchul Jeong(SK hynix),Hyungsoo Kim(SK hynix)2ImageSPEAKERSMinsu LeePrincipal Engineer,SK |Minsu Lee received the B.E.degree in Electronic Engineering in 2007 from the Kyungpook National University,Republic of Korea.He is a principal engineer in SK hynix Inc.His r

3、esearch interests include electromagnetic compatibility(EMC),system-level signal integrity,power integrity for DRAMs.3 Introduction EMI/RFI Characterization Root Cause Analysis of LPCAMM2 Radiation Experimental Validation of Cavity Resonance in LPCAMM2 Design Techniques to Eliminate Cavity Resonance

4、 in LPCAMM2 ConclusionOutline4Introduction5The rise of AI Laptops and the RFI Coexistence ChallengeEMC CLASSIFICATION6EMCElectromagnetic Compatibility:Ability of a system to function in its EM environment without causing or suffering interference.EMI VS.EMSEMI(Emission):Noise generated by the device

5、.EMS(Susceptibility):Ability to resist external noise.RFIRadio Frequency Interference:Specifically EMI that couples into RF antennas,causing receiver desensitizationMobile Evolution and Antenna Proximity7 Rapid growth of applications such as AI Agents,on-device AI along with the evolution of 5G,clou

6、d,edge computing infrastructure.increases integration density of semiconductor devices in mobile platforms.Compact platforms such as laptops and smartphones require close proximity between processing ICs and RF antennas.This proximity increases the risk of electromagnetic noise coupling into RF ante