DCON26_SLIDES_Track03_448GIsCopperStillaViableSolutionforIn-chassisConnections_241_206.pdf

1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,2026 1448G:Is Copper Still A Viable Solution For In-chassis Connections?2Track 3 Panel:Photonics and Wireless in Electrical Design This panel brings together a distinguished group of experts from across the industr

2、y,including package vendors,interconnect specialists,system designers,and test and validation professionals.Together,they will explore the possibilities and limitations of copper and optical interconnects at 448Gbps data rates,identify the challenges that must be addressed,and discuss strategies to

3、meet system budget constraints.Introduction3 Rula Bakleh from AMD Moderator John Calvin from Keysight 448G Spec Overview&Test and Validation Capabilities Sunil Priyadarshi from Arista Networks End-to-End System Designs Needs and Challenges Halil Cirit from Meta End-to-End System Integration Challeng

4、es Dean Gonzales from AMD Package&Board Technology From the Electrical Perspective Rajiv Pancholy from Broadcom Package&Board Technology From the Optics Perspective Sam Kocsis from Amphenol 448G Interconnect Innovations/Technology Panelists4Please hold-off your question until all panelists have had

5、the opportunity to present448G Spec Overview&Test and Validation Capabilities5John CalvinKeysight strategic product planner for high performance networking technology,Keysight Technologies Advances in high-speed serial TechnologyHigh Speed Networking Standards Compression174 Gbd PAM6(448 Gbps)150 Gb

6、d PAM8(448 Gbps)174 Gbd PAM6(448 Gbps)150 Gbd PAM8(448 Gbps)224 Gbd PAM4(448 Gbps)224 Gbd PAM4(448 Gbps)Aggregate SpeedYear/First SiliconSingle lane bit/ratePAM modulationSyms/UISignaling FundamentalScope BW BW RatioFilterChannel BWNotesPCIe 8.0(est)20262564264.0001091.74BT813.2Tbps202544842106.0001