DCON26_SLIDES_Track10_ANovelOff-BoardVerticalPowerSupplySolution_121_134.pdf

1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,2026 1A Novel Off-Board Vertical Power Supply SolutionZiqi Wang,New H3C TechnologiesZiqi Wang,New H3C Technologies Heidi Barnes,Keysight TechnologiesXiuguo Jiang,Keysight Technologies Tianzi Jiang,New H3C Technolog

2、iesXinyi Hu,New H3C TechnologiesHongling Zhang,New H3C TechnologiesZhuang Zuo,Luxshare Technologies2ImageImage SPEAKERSZiqi WangSI&PI Engineer,New H3C T|Ziqi Wang received his M.S.degree in Electrical Engineering from Syracuse University,Syracuse,NY,USA.He is now a SI&PI engineer for New H3C Technol

3、ogies focusing on Data Center.Before joining H3C,he worked as a SI&PI engineer in Huawei Technologies.Xiuguo JiangManager,Keysight T|Xiuguo Jiang,is the Manager of Great China EDA SE&CSM of Keysight Technologies,where he focuses on SI,PI,and EMC.He has more than 15 years of experience in Hardware an

4、d SI,and published over 5 books on SI,PI,and EE.3ImageSPEAKERSHeidi BarnesSenior Application Engineer,Keysight Technologies heidi_|Heidi Barnes is a Senior Application Engineer for Power Integrity and Power Electronics applications in the EDA Software Solutions Group of Keysight Technologies.Her rec

5、ent activities include the application of electromagnetic,transient,harmonic balance,and channel simulators to solve signal and power integrity challenges.Author of over 40 papers on SI and PI,technical contributor for the new IEEE-370 Standard involving interconnect S-parameter quality after fixtur

6、e removal,and recipient of the DesignCon 2017 Engineer of the Year.Served as Co-Chair for the IEEE EPS EDMS Packaging Benchmark Sub-Committee for 2 years.4 Introduction:oBackgroundoHow the ideas come?Proposed VPD solution:oLayoutoPI simulationoProcessing Engineering Technology Conclusion&Future work