DCON26_SLIDES_Track01_DistributedCapacitorCharacterizationforAdvancedPackaging_143_86.pdf

1、Welcome to ConferenceFebruary 2426,2026Santa Clara Convention CenterExpoFebruary 2526,2026 1Distributed Capacitor Characterization for Advanced PackagingSivaseetharaman Pandi,(Amazon)Uday Raj Shakelli,(Amazon)Sivaseetharaman Pandi,(Amazon),Uday Raj Shakelli(Amazon)Gustavo Blando(Amazon),Istvan Novak

2、(SAMTEC)2ImageImage SPEAKERSSivaseetharaman PandiSenior SIPI Engineer,AmazonSUday Raj ShakelliSenior SIPI Engineer,A3ImageImage SPEAKERSGustavo BlandoSIPI Manager,AIstvan NovakPrincipal Signal and Power Integrity Engineer,Samtec inc.Istvan.N 4Abstract5 Distributed capacitors play crucial role in pow

3、er integrity for modern GPUs High current delivery with minimal voltage ripple is essential Comprehensive characterization methodology presented Includes measurement techniques,modeling,and simulation correlation Temperature and bias voltage dependencies characterized Modern AI Workloads Demand Extr

4、eme Power AI accelerators(GPUs,TPUs,ASICs)require 400-700W+power Peak currents exceed 1000 amperes Rapid current transients occur in nanosecond timescales High di/dt events create severe voltage droops PDN noise threatens system reliability The Challenge:Traditional power delivery solutions struggle

5、 to meet these demandsIntroduction-The AI Power Challenge6 Rapid di/dt Events AI accelerators experience rapid current transients during training/inference cycles Transient timescales:10s of Nanoseconds Frequency content Extends into tens of MHz Current swings:Hundreds of amperes Creates severe volt

6、age droops and PDN noise Threatens system reliability and performance Impact:Voltage instability can cause computational errors or system failures Challenge:Power delivery network must respond within nanosecondsCurrent Transient Challenges7 Power Delivery Network Coverage Frequency Domains:On-die ca