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DCON26_PAPER_Track13_BreakingtheBandwidthBarrierTestFixturesandMethodologiesfor448GbpsDataTransmission_167_63.pdf

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1、 Information Classification:General Breaking the Bandwidth Barrier:Test Fixtures and Methodologies for 448Gbps Data Transmission Tahoura Mosavirik,Amphenol Jose R.Paniagua,Amphenol Sam Kocsis,Amphenol Information Classification:General Abstract As data rates continue to scale beyond 224Gbps,the corr

2、esponding Nyquist frequencies are pushing the limits of current high-speed interconnect and cable assembly characterization.While standard test fixtures and methodologies can reliably support measurements up to 67 GHz,extending accurate and repeatable measurements to 110 GHz introduces significant c

3、hallenges in maintaining signal integrity.With higher Nyquist frequencies,the reduction in wavelength increased sensitivity to discontinuities,dielectric losses,and geometric variations in the channel.This complicates the design and performance of test fixtures,demanding novel solutions to ensure ac

4、curate testing.Higher bandwidth measurements are necessary to create accurate time-domain resolution for device and channel verification and validation.At these ultra-high frequencies,traditional assumptions about materials,design practices,and measurement fixtures begin to break down.Printed circui

5、t board(PCB)design demands tighter tolerance,enhanced via transitions,and more sophisticated launch structures to mitigate reflection,mode conversion,and impedance discontinuities.The migration from standard 1.85 mm SMA launch connectors to 1.0 mm interfaces to support bandwidths up to 110 GHz is al

6、ready well underway.However,there are still a lot of details to work through related to defining accurate characterization methodologies at 110 GHz,capable of capturing extremely fast signal transitions and resolving fine-scale channel impairments.The aforementioned challenges necessitate re-evaluat

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1. **研究目标**:解决448Gbps数据传输(Nyquist频率达110GHz以上)的测试夹具与信号完整性挑战,传统方法在67GHz以上失效。 2. **关键发现**: - 插入损耗优化:优化接地过孔(如PCB B比A低67.31%损耗)、金镀层(比锡镀层更稳定)及垂直发射器(1mm比1.85mm损耗低7dB)。 - 材料与设计:低Dk/Df材料、多层压合板及精确过渡区设计(如反焊盘几何形状)可减少反射,PAM6在89.6GHz损耗仅-3.48dB。 3. **调制方案**:PAM8(74.7GHz)比PAM4(112GHz)更易量产,但需平衡带宽与噪声敏感度。 4. **未来方向**:需HDI/MSAP工艺提升制造精度,量化 intra-pair skew,优化连接器设计以支持超高速部署。
**448Gbps如何实现?** **高频测试有何难点?** **PAM调制如何选择?**
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