DCON26_PAPER_Track04_EnhancingLossPerformanceLinePrecisioninUHDIPCBsUsingAdvancedPackagingMaterialsIonBeamT_104_186.pdf

1、 Information Classification:General Enhancing Loss Performance and Line Precision in UHDI PCBs Using Advanced Packaging Materials and Ion Beam Technology Jian Yang,Ruijie Networks Co.,L QianFa liu,Shengyi Technology L Yongming Zhu,Shengyi Technology Junqi Tang,Shengyi Technology T Bin Liao,Beijing N

2、ormal University Pan Pang,Beijing Normal University Scarlet Wang,Shengyi Technology Shihong Lu,Ruijie Networks Co.,L Information Classification:General Abstract This paper addresses the challenges of high signal loss and insufficient line precision in PCBs under ultra high density interconnect(UHDI)

3、processing.We propose a comprehensive technical solution integrating advanced packaging materials with ion beam technology.By employing advanced packaging materials,we enhance the electrical performance and thermal stability of large-sized PCBs.This reduces the dielectric dissipation factor(Df)of bu

4、ildup films and the coefficient of thermal expansion(CTE)during soldering,thereby improving long-term solder joint reliability.Concurrently,ion beam technology enables atomic-scale seed layer deposition on substrate surfaces.Coupled with innovations based on the modified semi-additive process(mSAP),

5、this approach achieves high-precision manufacturing of ultra-small vias and ultra-fine line width/spacing,significantly increasing PCB wiring density.Author(s)Biography Jian Yang is a senior SI Engineer at Ruijie Networks,focuses on signal integrity and power integrity studies.He has 8 years of expe

6、rience in data center switch products development.Qianfa Liu is a Director of the National Engineering Research Center for Electronic Circuit Base Materials,leading corporate-wide technological innovation initiatives.He has 28 years laminate industry experience.Concurrently,he holds positions as Vic