DCON26_PAPER_Track04_BreakthroughsinPCBTechnologyforPCIe7.0Interconnects_171_18.pdf

1、 1 Information Classification:General Breakthroughs in PCB Technology for PCIe 7.0 Interconnects Dan Liu,Alibaba Cloud Computing ld259920alibaba- Yangfan Zhong,Alibaba Cloud Computing yangfan.zyfalibaba- Honghao Cao,Alibaba Cloud Computing honghao.chhalibaba- Mo Liu,Synopsys Jianan Ma,New H3C Wayne

2、Wang,Shennan Circuit Co.,Ltd 2 Information Classification:General Abstract Optimizing the interconnect components electrical performance is essential to enable PCIe 7.0 operation at 128Gbps.Pin field area has been identified as a key bottleneck due to elevated reflections and crosstalk caused by rou

3、ting area congestion and increased PCB board thickness especially in AI and MCP-driven products.Previous PCIe 7.0 study was primarily done on PCB pin field area optimizations through simulations.In this paper,we focus on PCB technology enabling which includes precision registration improvements,adva

4、nced backdrilling techniques,and innovative manufacturing methods.A comprehensive set of measurement data is presented,consisting of signal integrity performance of various PCB configurations with variations in breakout trace width and spacing,Via pad stack geometries,stub lengths,and backdrilling f

5、illing materials.The results successfully demonstrate the feasibility of thinner trace geometries and smaller Via pad stack dimensions and shorter via stubs achieved through advanced PCB manufacturing processes.Physical validation via cross-sectioning and high-resolution microscopy confirmed critica

6、l dimensions within tolerance.The manufacturing precision correlated with measured signal integrity improvements.The breakthroughs of PCB technology mark a significant step forward in PCIe 7.0 interconnect enabling.Author(s)Biography Dan Liu is a staff engineer in Alibaba.Prior to joining Alibaba in