Hot_Chips_2022_CXL_Memory_Expander_final.pdf

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1、Scaling of Memory Performance and Capacitywith CXL Memory Expander August,2022|Samsung Electronics Co.,Ltd.S.J.Park,K.-S.Kim,H.Kim,J.So,J.Ahn,J.Jung,I.Yun,S.Ryu,W.-J.Lee,J.-G.Lee,H.-Y.Ryu,C.Y.Lee,J.Prout,K.-C.Ryoo,S.-J.Han,M.-K.Kook,J.S.Choi,J.Gim,Y.S.Ki,S.Ryu,C.Park,D.-G.Lee,J.Cho,H.Song,and J.Y.Le

2、eAgendaIndustry Trends and ChallengesIntroduction of CXL(Compute Express Link)CXL Memory Expander FeaturesSMDK:Unified Software Solution for CXLApplication Benchmark Test ResultsSummary and Future PlanIndustry Trends and ChallengesArtificial IntelligenceBig DataEdgeCloud5GMassive demand for data-cen

3、tric technologies and applicationsMemory bandwidth and density not keeping up with increasing CPU core countNeed a next gen interconnect for heterogeneous computing and server disaggregationThe Fast-Growing Computing WorkloadsNETtalk19602020PerceptronALVINNRNN for SpeechTD-Gammon v2.1LeNet-5BiLSTM f

4、or SpeehDeep Belief Nets&Layer-wise pretrainingAlexNetResNetsGPT-3LaMBDAFirst EraModern EraLarge-scale adoption of AI and MLSmarter devicesHyper-connected networksSuper-intelligent servicesDigital transformationPandemicEvolution of Hyperscale Computing EnvironmentFrom Converged to Composable Archite

5、ctureNetwork ChallengeConverged ArchitectureTOR based Rack Scalable ArchitectureServerTORTOR.CPUDRAMGPUSSDStorageNetwork&Storage SwitchHyper-Converged ArchitectureInterconnect ChallengeDisaggregated/ComposableArchitectureServer&Storage Combined Architecture.SmartNICMS CatapultAWS NitroCPUDRAMGPUSSDD

6、ivergence ChallengeCPUDRAMGPUSSDPooled Arch.:Memory,Compute,StorageThe Rising Need for Better ConnectivitySoC InterconnectProcessorInterconnectData CenterInterconnectCustomerInterconnectDIE/PACKAGENODEDATA CENTERMOBILE/BROADBANDA new class of interconnectfor device connectivity in the era of AI Can